文献
J-GLOBAL ID:202102234490104391
整理番号:21A2057434
発光ダイオードチップスケールパッケージに用いられるチタン改質シリコーンの高温性能評価と寿命予測【JST・京大機械翻訳】
High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages
著者 (6件):
Yu Si
(College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518055, China)
,
Wang Zhen
(College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China; Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China)
,
Fan Jiajie
(College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China; Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China; Department of Microelectronics, Delft University of Technology, Delft 2628 CD, The Netherlands)
,
Qian Cheng
(School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China)
,
Deng Zhentao
(College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518055, China)
,
Gui Dayong
(College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518055, China)
資料名:
Journal of Electronic Packaging
(Journal of Electronic Packaging)
巻:
142
号:
2
ページ:
Null
発行年:
2020年
JST資料番号:
T0929A
ISSN:
1043-7398
CODEN:
JEPAE4
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)