文献
J-GLOBAL ID:202102243173655163
整理番号:21A0237423
エポキシ樹脂の熱伝導率に及ぼすアミン硬化剤分子構造の影響【JST・京大機械翻訳】
Effect of Amine Hardener Molecular Structure on the Thermal Conductivity of Epoxy Resins
著者 (6件):
Lv Guangxin
(Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois at Urbana-Champaign, Illinois, United States)
,
Jensen Elynn
(Department of Chemistry and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Illinois, United States)
,
Shen Chengtian
(Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois, United States)
,
Yang Kexin
(Department of Physics, University of Illinois at Urbana-Champaign, Illinois, United States)
,
Evans Christopher M.
(Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois at Urbana-Champaign, Illinois, United States)
,
Cahill David G.
(Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois at Urbana-Champaign, Illinois, United States)
資料名:
ACS Applied Polymer Materials
(ACS Applied Polymer Materials)
巻:
3
号:
1
ページ:
259-267
発行年:
2021年
JST資料番号:
W5670A
ISSN:
2637-6105
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)