文献
J-GLOBAL ID:202102247597384212
整理番号:21A1712442
650V GaNパワーデバイスにおける応力下のR_on増加に及ぼす基板終端の影響【JST・京大機械翻訳】
Effects of substrate termination on Ron increase under stress in 650 V GaN power devices
著者 (10件):
Li Feiyu
( School of Microelectronics, Dalian University of Technology, Dalian 116024, People’s Republic of China)
,
Wang Ronghua
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
,
Huang Huolin
( School of Microelectronics, Dalian University of Technology, Dalian 116024, People’s Republic of China)
,
Huang Huolin
( School of Optoelectronic Engineering and Instrumentation Science, Dalian University of Technology, Dalian 116024, People’s Republic of China)
,
Ren Yongshuo
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
,
Ren Guangshan
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
,
Liang Zhuang
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
,
Zhou Fubin
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
,
Cheng Wanxi
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
,
Liang Huinan
( Dalian Xinguan Technology Corporation, Dalian 116023, People’s Republic of China)
資料名:
Journal of Physics. D. Applied Physics
(Journal of Physics. D. Applied Physics)
巻:
54
号:
26
ページ:
265106 (6pp)
発行年:
2021年
JST資料番号:
B0092B
ISSN:
0022-3727
CODEN:
JPAPBE
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)