文献
J-GLOBAL ID:202102248453006945
整理番号:21A0011535
実験とモデリングの複合アプローチによるアンダーフィル-ポリマ界面接着強度の解析【JST・京大機械翻訳】
Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches
著者 (12件):
Yeh Shu-Shen
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Lin P. Y.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Hsu C. K.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Lin Y. S.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Wang J. H.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Lai P. C.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Liao L. L.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Lee T. Y.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Chen C. H.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Yew M. C.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Cheng S. K.
(Taiwan Semiconductor Manufacturing Company, (TSMC))
,
Jeng Shin-Puu
(Taiwan Semiconductor Manufacturing Company, (TSMC))
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2020
号:
IMPACT
ページ:
1-4
発行年:
2020年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)