文献
J-GLOBAL ID:202102261158981257
整理番号:21A0011539
薄型ウエハ集積のためのレーザリリース可能な一時的ボンディング接着剤の評価【JST・京大機械翻訳】
Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration
著者 (5件):
Ou-Yang T. Y.
(Electronic and Optoelectronic System Research Laboratories Industrial Technology Research Institute Rm. 200-10, Bldg. 17, No.195, Sec. 4, Chung Hsing Rd., Chutung,Hsinchu,Taiwan (R.O.C.),31040)
,
Chang H. H.
(Electronic and Optoelectronic System Research Laboratories Industrial Technology Research Institute Rm. 200-10, Bldg. 17, No.195, Sec. 4, Chung Hsing Rd., Chutung,Hsinchu,Taiwan (R.O.C.),31040)
,
Hsu C. K.
(Electronic and Optoelectronic System Research Laboratories Industrial Technology Research Institute Rm. 200-10, Bldg. 17, No.195, Sec. 4, Chung Hsing Rd., Chutung,Hsinchu,Taiwan (R.O.C.),31040)
,
Fu H. C.
(Electronic and Optoelectronic System Research Laboratories Industrial Technology Research Institute Rm. 200-10, Bldg. 17, No.195, Sec. 4, Chung Hsing Rd., Chutung,Hsinchu,Taiwan (R.O.C.),31040)
,
Liao Y. S.
(Electronic and Optoelectronic System Research Laboratories Industrial Technology Research Institute Rm. 200-10, Bldg. 17, No.195, Sec. 4, Chung Hsing Rd., Chutung,Hsinchu,Taiwan (R.O.C.),31040)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2020
号:
IMPACT
ページ:
32-35
発行年:
2020年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)