文献
J-GLOBAL ID:202202212675618963
整理番号:22A0553324
繰返しUIS応力下の並列接続4H-SiC MOSFETの劣化に関する研究【JST・京大機械翻訳】
Investigation on the Degradations of Parallel-Connected 4H-SiC MOSFETs Under Repetitive UIS Stresses
著者 (9件):
Mao Hua
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Qiu Guanqun
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Jiang Xiaofeng
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Jiang Huaping
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Zhong Xiaohan
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Tang Lei
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Zhang Yifu
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Ran Li
(State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China)
,
Wu Yuping
(State Grid Jibei Electric Power Co., Ltd., Beijing, China)
資料名:
IEEE Transactions on Electron Devices
(IEEE Transactions on Electron Devices)
巻:
69
号:
2
ページ:
650-657
発行年:
2022年
JST資料番号:
C0222A
ISSN:
0018-9383
CODEN:
IETDAI
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)