文献
J-GLOBAL ID:202202219891617843
整理番号:22A0921641
プラズマ改質による銀アンモニアによるポリイミド表面への直接添加銅めっき【JST・京大機械翻訳】
Direct additive copper plating on polyimide surface with silver ammonia via plasma modification
著者 (10件):
Xiang Junlun
(School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, PR China)
,
Zhou Guoyun
(School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, PR China)
,
Hong Yan
(School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, PR China)
,
He Wei
(Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd. & Zhuhai Founder Sci-Tech multilayer circuit board Co., Ltd, Zhuhai, 519175, PR China)
,
Wang Shouxu
(School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, PR China)
,
Chen Yuanming
(Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd. & Zhuhai Founder Sci-Tech multilayer circuit board Co., Ltd, Zhuhai, 519175, PR China)
,
Wang Chong
(School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, PR China)
,
Tang Yao
(Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd. & Zhuhai Founder Sci-Tech multilayer circuit board Co., Ltd, Zhuhai, 519175, PR China)
,
Sun Yukai
(Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd. & Zhuhai Founder Sci-Tech multilayer circuit board Co., Ltd, Zhuhai, 519175, PR China)
,
Zhu Yongkang
(Netron Soft-tech (Zhuhai) Co., Ltd, Zhuhai, 519040, PR China)
資料名:
Applied Surface Science
(Applied Surface Science)
巻:
587
ページ:
Null
発行年:
2022年
JST資料番号:
B0707B
ISSN:
0169-4332
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)