文献
J-GLOBAL ID:202202226824166190
整理番号:22A1160564
高温電子パッケージング用途における成形コンパウンド用のビスマレイミド/フェノール/エポキシ三成分樹脂系【JST・京大機械翻訳】
Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications
著者 (7件):
Li Xiaohan
(Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Jiangsu, PR China)
,
Zhou Yanglong
(Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Jiangsu, PR China)
,
Bao Ying
(Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Jiangsu, PR China)
,
Wei Wei
(Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Jiangsu, PR China)
,
Fei Xiaoma
(Wuxi Chuangda Advanced Materials Co., Ltd., Jiangsu, PR China)
,
Li Xiaojie
(Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Jiangsu, PR China)
,
Liu Xiaoya
(Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Jiangsu, PR China)
資料名:
Industrial & Engineering Chemistry Research
(Industrial & Engineering Chemistry Research)
巻:
61
号:
12
ページ:
4191-4201
発行年:
2022年
JST資料番号:
C0385C
ISSN:
0888-5885
CODEN:
IECRED
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)