文献
J-GLOBAL ID:202202230782441743
整理番号:22A0737458
銅膜の無拘束振動条件下の転位逆戻りに基づく疲れ損傷治癒モデル【JST・京大機械翻訳】
Fatigue damage healing model based on dislocation reverse-back under unconstraint vibration condition for copper film
著者 (5件):
Zhang Hai-Meng
(College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China)
,
Zhang Hai-Meng
(Shandong Engineering Research Center of Aeronautical Materials and Devices, Binzhou University, Binzhou 256600, China)
,
Shang De-Guang
(College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China)
,
Liu Xiao-Dong
(College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China)
,
Zhang Yu
(College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China)
資料名:
Engineering Failure Analysis
(Engineering Failure Analysis)
巻:
134
ページ:
Null
発行年:
2022年
JST資料番号:
W0684A
ISSN:
1350-6307
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)