文献
J-GLOBAL ID:202202235356334027
整理番号:22A0945814
Sn系はんだとFeCoNiCu合金の界面反応に及ぼすCuの影響【JST・京大機械翻訳】
Effect of Cu on the interfacial reaction between Sn-based solders and FeCoNiCu alloys
著者 (6件):
Shen Yu-An
(Department of Materials Science and Engineering, Feng Chia University, Taichung, 407, Taiwan, ROC)
,
Yang Xiu-Mei
(Department of Materials Science and Engineering, Feng Chia University, Taichung, 407, Taiwan, ROC)
,
Tsai Cheng-Yu
(Department of Materials Science and Engineering, Feng Chia University, Taichung, 407, Taiwan, ROC)
,
Ouyang Yu-Hung
(Department of Materials Science and Engineering, Feng Chia University, Taichung, 407, Taiwan, ROC)
,
Tsai Ming-Hung
(Department of Materials Science and Engineering, National Chung Hsing University, Taichung, 40227, Taiwan, ROC)
,
Shun Tao-Tsung
(Department of Materials Science and Engineering, Feng Chia University, Taichung, 407, Taiwan, ROC)
資料名:
Intermetallics
(Intermetallics)
巻:
144
ページ:
Null
発行年:
2022年
JST資料番号:
W0672A
ISSN:
0966-9795
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)