文献
J-GLOBAL ID:202202237441496065
整理番号:22A0956049
マイクロカンチレバー曲げ技術を用いたSiN/GaAs膜/基板系の界面接着評価【JST・京大機械翻訳】
Interfacial adhesion assessment of SiN/GaAs film/substrate system using microcantilever bending technique
著者 (5件):
Lin Weikang
(School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, 4072, Australia)
,
Zhao Yitian
(School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, 4072, Australia)
,
Wang Feng
(HBIS Group, Shijiazhuang, Hebei Province, People’s Republic of China)
,
Huang Han
(School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, 4072, Australia)
,
Lu Mingyuan
(School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, 4072, Australia)
資料名:
Journal of Physics. D. Applied Physics
(Journal of Physics. D. Applied Physics)
巻:
55
号:
24
ページ:
245104 (9pp)
発行年:
2022年
JST資料番号:
B0092B
ISSN:
0022-3727
CODEN:
JPAPBE
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)