文献
J-GLOBAL ID:202202239378006819
整理番号:22A0224888
Zn_4Sb_3熱電材料と種々の金属電極間の界面における金属間化合物成長【JST・京大機械翻訳】
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
著者 (4件):
Chen Chun-Hao
(Institute of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan)
,
Lee Pei-Ing
(Institute of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan)
,
Yeh Wei-Ting
(Institute of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan)
,
Chuang Tung-Han
(Institute of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan)
資料名:
Metallurgical and Materials Transactions. A. Physical Metallurgy and Materials Science
(Metallurgical and Materials Transactions. A. Physical Metallurgy and Materials Science)
巻:
53
号:
1
ページ:
136-146
発行年:
2022年
JST資料番号:
E0265B
ISSN:
1073-5623
CODEN:
MTTABN
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)