文献
J-GLOBAL ID:202202246086891345
整理番号:22A1156935
平滑CuおよびENIAg表面仕上げ上のMWCNTs強化Sn-1.0Ag-0.5Cu(SAC105)複合はんだ相互接続の界面微細構造進展と剪断強さ【JST・京大機械翻訳】
Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
著者 (8件):
Dele-Afolabi T. T.
(Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia (UPM), Serdang, Selangor, Malaysia)
,
Dele-Afolabi T. T.
(Department of Mechanical Engineering, Faculty of Engineering, Ajayi Crowther University, Oyo, Oyo State, Nigeria)
,
Hanim M. A. Azmah
(Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia (UPM), Serdang, Selangor, Malaysia)
,
Hanim M. A. Azmah
(Advance Engineering Materials and Composites Research Center, (AEMC), Faculty of Engineering, Universiti Putra Malaysia (UPM), Serdang, Selangor, Malaysia)
,
Vidyatharran K.
(Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia (UPM), Serdang, Selangor, Malaysia)
,
Matori K. A.
(Department of Physics, Faculty of Science, Universiti Putra Malaysia (UPM), Serdang, Selangor, Malaysia)
,
Azlina O. Saliza
(Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, Johor, Malaysia)
,
Calin R.
(Department of Metallurgy and Materials Engineering, Faculty of Engineering, Kirikkale University, Kirikkale, Turkey)
資料名:
Journal of Materials Science. Materials in Electronics
(Journal of Materials Science. Materials in Electronics)
巻:
33
号:
10
ページ:
8233-8246
発行年:
2022年
JST資料番号:
W0003A
ISSN:
0957-4522
CODEN:
JMTSAS
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)