文献
J-GLOBAL ID:202202257583531754
整理番号:22A0569250
Sn-CuおよびSn-Biはんだ合金の共晶範囲に影響する局所凝固熱パラメータ【JST・京大機械翻訳】
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys
著者 (6件):
Kakitani Rafael
(Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, Campinas, Brazil)
,
Pinto da Silva Cassio Augusto
(Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, Campinas, Brazil)
,
Silva Bismarck
(Department of Materials Engineering, Federal University of Rio Grande do Norte, UFRN, Natal, Brazil)
,
Garcia Amauri
(Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, SP, Brazil)
,
Cheung Noe
(Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, SP, Brazil)
,
Spinelli Jose Eduardo
(Department of Materials Engineering, Federal University of Sao Carlos, UFSCar, Sao Carlos, Brazil)
資料名:
Soldering & Surface Mount Technology
(Soldering & Surface Mount Technology)
巻:
34
号:
1
ページ:
24-30
発行年:
2022年
JST資料番号:
H0953A
ISSN:
0954-0911
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)