文献
J-GLOBAL ID:202202264267129735
整理番号:22A0434136
Cu-Sn過渡液相接合のためのCu電気めっき層の表面改質【JST・京大機械翻訳】
Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding
著者 (5件):
Hsu Shao-Yu
(Department of Chemical Engineering, National Chung Hsing University, 145 Xingda Rd, South Dist, Taichung, 402, Taiwan)
,
Chen Chih-Ming
(Department of Chemical Engineering, National Chung Hsing University, 145 Xingda Rd, South Dist, Taichung, 402, Taiwan)
,
Chen Chih-Ming
(Innovation and Development Center of Sustainable Agriculture IDCSA, National Chung Hsing University, Taichung, 402, Taiwan)
,
Song Jenn-Ming
(Department of Materials Science and Engineering, National Chung Hsing University, 145 Xingda Rd, South Dist, Taichung, 402, Taiwan)
,
Nishikawa Hiroshi
(Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan)
資料名:
Materials Chemistry and Physics
(Materials Chemistry and Physics)
巻:
277
ページ:
Null
発行年:
2022年
JST資料番号:
E0934A
ISSN:
0254-0584
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)