文献
J-GLOBAL ID:202202289757357875
整理番号:22A1101855
レーザ誘起前方移動における超薄チップ移動の理論的モデリングと実験的研究【JST・京大機械翻訳】
Theoretical Modeling and Experimental Studies of Ultra-Thin Chip Transfer in Laser-Induced Forward Transfer
著者 (6件):
Hong Jinhua
(Mechanical and Electrical Engineering School, Nanchang University, Nanchang, China)
,
Cheng Peng
(Mechanical and Electrical Engineering School, Nanchang University, Nanchang, China)
,
Chen Wei
(Mechanical and Electrical Engineering School, Nanchang University, Nanchang, China)
,
Guo Jinhong
(Mechanical and Electrical Engineering School, Nanchang University, Nanchang, China)
,
Li Yulong
(Mechanical and Electrical Engineering School, Nanchang University, Nanchang, China)
,
Liu Jizhong
(Mechanical and Electrical Engineering School, Nanchang University, Nanchang, China)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
12
号:
3
ページ:
570-577
発行年:
2022年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)