文献
J-GLOBAL ID:202202290794776626
整理番号:22A0799451
均一積層チップ相互接続のためのマイクロ流体無電解堆積:シミュレーションフレームワークと実験検証【JST・京大機械翻訳】
Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation
著者 (8件):
Zhang Yonglin
(Department of Mechanical and Aerospace Engineering, School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region)
,
Yao Peilun
(Department of Mechanical and Aerospace Engineering, School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region)
,
Han Yuzi
(Department of Mechanical and Aerospace Engineering, School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region)
,
Yang Jun
(Department of Mechanical and Aerospace Engineering, School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region)
,
Chen Haibin
(Department of Mechanical and Aerospace Engineering, School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region)
,
Wu Jingshen
(Smart Manufacturing Thrust, Systems Hub, Hong Kong University of Science and Technology, Guangzhou, China)
,
Yang Jinglei
(Department of Mechanical and Aerospace Engineering, School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong Special Administrative Region)
,
Yang Jinglei
(HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute, Futian, Shenzhen, China)
資料名:
Chemical Engineering Journal
(Chemical Engineering Journal)
巻:
434
ページ:
Null
発行年:
2022年
JST資料番号:
D0723A
ISSN:
1385-8947
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)