文献
J-GLOBAL ID:202202292171146671
整理番号:22A1119894
離散熱負荷を有する回路基板用の液体冷却ヒートシンクの技術的および商業的生存能力評価【JST・京大機械翻訳】
Technical and commercial viability assessment of liquid-cooled heat sinks for a circuit board with discrete heat loads
著者 (4件):
Morse Joshua
(Keysight Technologies, Santa Rosa, CA 95403, United States)
,
Morse Joshua
(Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, United States)
,
Paniagua-Guerra Luis E.
(Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, United States)
,
Ramos-Alvarado Bladimir
(Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802, United States)
資料名:
Applied Thermal Engineering
(Applied Thermal Engineering)
巻:
210
ページ:
Null
発行年:
2022年
JST資料番号:
E0667B
ISSN:
1359-4311
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)