Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma. Self-assembled layer as an effective way to block copper diffusion into epoxy. Materials Letters. 2024. 367. 136589-136589
Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Rieko Okumura, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma. Effects of high temperature and high humidity on the reliability of copper/epoxy bond. Applied Surface Science. 2024. 660. 159970-159970
Shuaijie Zhao, Chuantong Chen, Masahiko Nishijima, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma. Copper diffusion into epoxy under high temperature. Materials Letters. 2024. 361. 136157-136157
Shuaijie Zhao, Chuantong Chen, Hang Liang, Shuohan Wang, Fuminobu Kimura, Yusuke Kajihara. Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach. Applied Surface Science. 2024. 159694-159694
Chuantong Chen, Shuaijie Zhao, Takuya Sekiguchi, Katsuaki Suganuma. Large-scale bare Cu bonding by 10 μm-sized Cu-Ag composite paste in low temperature low pressure air conditions. Journal of Science: Advanced Materials and Devices. 2023. 8. 3. 100606-100606