研究キーワード (10件):
power amplifier
, low noise amplifier
, voltage controlled oscillator
, transmission line interconnect
, transmission line
, 電力増幅器
, 低雑音増幅器
, 電圧制御発振器
, 伝送線路配線
, 伝送線路
競争的資金等の研究課題 (16件):
2025 - 2028 セルフパワードウェアラブル口腔内情報モニタリングシステムの開発
2024 - 2027 妨害波を活用した極低消費電力無線技術の創成
2021 - 2024 静電誘導型発電シートを用いたウェアラブル型リアルタイム咬合力測定方法の開発
2019 - 2023 ヘテロジニアス微小ノード群による無線通信機能の創発
2018 - 2021 生体内ウェアラブル測定装置による義歯床下荷重解析に基づく最適義歯設計の探索
2015 - 2018 伝送線路理論に基づく土壌成分測定技術の研究
2012 - 2015 エネルギー・ハーベスティングの高効率化限界の追求
2012 - 2014 細胞サイズRF CMOSトランシーバ回路技術の研究
2006 - 2009 ナノスケール配線および回路のシグナル・インテグリティに関する研究
2008 - 2008 義脳チップを目指したinter-brain通信回路の研究
2004 - 2007 通信理論に基づくオンチップ超高速ナノスケールネットワークの開発
2004 - 2006 シリコン集積回路多層配線における伝送線路配線を用いた高速信号伝送の研究
2002 - Investigation of High-Speed Signal Transmission on Si CMOS LSI
2002 - 集積回路における高速信号配線技術の研究
Multi-band RF CMOS circuit
マルチバンドRF CMOS回路の研究
全件表示
論文 (137件):
Devi Srujana Tenneti, Chihaya Mukaide, Kisuke Miyado, Torauto Yamada, Katsuyuki Machida, Tomoyuki Kurioka, Tso-Fu Mark Chang, Masato Sone, Yoshihiro Miyake, Hiroyuki Ito. Design and evaluation of a dual-detection range single-axis MEMS capacitive accelerometer with gold proof-mass structure for suppressed warpage. Japanese Journal of Applied Physics. 2025
Kazuya Fujita, Kosuke Suzuki, Keisuke Asano, Chun-Yi Chen, Tomoyuki Kurioka, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone, Tso-Fu Mark Chang. Simultaneous Necking and Barreling Deformation Behaviors in Bending of Single-Crystal Gold Micro-Cantilever. Materials. 2024. 17. 16. 4054-4054
Ryohei Hori, Kazuya Fujita, Chun Yi Chen, Tomoyuki Kurioka, Jhen-Yang Wu, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Cross-sectional geometry effect on bending strength of gold micro-cantilever with trapezoidal cross-section. Micro and Nano Engineering. 2024. 23. 100259-100259
Syota Kanno, Taro Omura, Tomoyuki Kurioka, Chun-Yi Chen, Parthojit Chakraborty, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone, Tso-Fu Mark Chang. Effects of the strain rate in compression of electrodeposited gold micro-pillars toward the design of MEMS components. Micro and Nano Engineering. 2024. 100254
Taro Omura, Tomoyuki Kurioka, Chun Yi Chen, Tso Fu Mark Chang, Akira Onishi, Parthojit Chakraborty, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Warpage Study of Electrodeposited-Au Micro-Components with Ti/Au Multi-Layered Structures toward MEMS Applications. Journal of the Electrochemical Society. 2024. 171. 3
A 20 Gb/s 1:4 DEMUX with Near-Rail-to-Rail Logic Swing in 90 nm CMOS process
(2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects (IMWS2009-R9) 2009)
Investigation of Scalable Wideband RF CMOS Low Noise Amplifier Using Inveter Construction
(2009)
S-parameter-based modal decomposition of multiconductor transmission lines and its application to de-embedding
(International Conference on Microelectronic Test Structures (ICMTS) 2009)
A 20 Gb/s 1:4 DEMUX with Near-Rail-to-Rail Logic Swing in 90 nm CMOS process
(2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects (IMWS2009-R9) 2009)