Evaluation Method of Interaction Relation between Design Factors Andsimple Assessment Approach for BGA Package Reliability. Proc. of the ASME 2007 InterPack Conference(InterPack'07). 2007. 1-7(Interpack2007-33242)
Koyama,T. Low - cycle fatigue reliability evaluation for lead - free solders in vehicle electronics devices. Proc. of the ASME 2007 InterPack Conference(InterPack'07). 2007. 1-7(Interpack2007-33250)
Koyama,T. Low - cycle fatigue reliability evaluation for lead - free solders in vehicle electronics devices. Proc. of the ASME 2007 InterPack Conference(InterPack'07). 2007. 1-7(Interpack2007-33250)
Various Levels of Drop Analysis for BGA in Mobile Phones. Proc. of the ASME 2007 InterPack Conference(InterPack'07). 2007. 1-9(Interpack2007-33251)
A Study on Repetitive Drop test Method and for Electronic Component. Proc. of the ASME 2007 InterPack Conference(InterPack'07). 2007. 1-6(Interpack2007-33345)