Atsushi Okuno. PES (printing Encapsulation Systems) of Advanced Mulitichip Module and COB Device IEEE Transitions on Components. Packaging and Manufacturing Technology. 1994, 17, 143-150
Atsushi Okuno. PES of Some BGA Packaging. ISHM. 1994, 96, 103-106
Atsushi Okuno. Flip-Chip Packaging Using PES and Under-Fill Epoxy Resin 45th ECTC (IEEE). 1995, 1240-1243