KUSAGAYA, K. Flip Chip Mounting Using Stud Bumps and Adhesives for Enchapsulation. Proceedings of International Conference on Multichip Modules. 1993, 587-595
VIERTL, B. Flip Chip with Polymer Bumps on Various Substrates. Proceedings of First International Conference on Adhesives in Electronics, Berlin. 1994
OTSUKA, K. High Frequency Characterization of Conductive Adhesive and Its Interconnection Technology. Proceedings of Adhesive in Electronics '96. 1996, 114-125
OTSUKA, K. High Frequency Characterization of Conductive Adhesive. Extended Abstract of Third VLSI Packaging Workshop of Japan. 1996, 87-91