Eunjin Jo, YehRi Kim, Sangmin Lee, Masahiko Nishijima, Chuantong Chen, Katsuaki Suganuma, Young-Bae Park, Dongjin Kim. Oxidation-free silver porous sheet bonding onto a bare copper substrate in air. Materials Letters. 2025
Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hiroki Seto, Kei Hashizume, Yuhei Kitahara, et al. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate. Applied Surface Science. 2024. 678. 161128-161128
Sangmin Lee, Seungyeop Baek, Seung-Joon Lee, Chuantong Chen, Masahiko Nishijima, Katsuaki Suganuma, Hiroshi Utsunomiya, Ninshu Ma, Ha-Young Yu, Dongjin Kim. Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding. Materials Science and Engineering: A. 2024. 915. 147178-147178
Wangyun Li, Chuantong Chen, Masahiko Nishijima, Minoru Ueshima, Hiroshi Nishikawa, Katsuaki Suganuma. Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition. Materials & Design. 2024
Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma. Metastable phases of Ag-Si: amorphous Si and Ag-nodule mediated bonding. Scientific Reports. 2024. 14. 1
Effect of Ni Addtion on Electroless Cu for High Density Interconnect PCB Substrate
(245th ECS Meeting 2024)
Quantitative Elemental Characterization for Electroless Cu Plating Interface of Micro-via by ToF-SIMS
(International Conference on Electronics Packaging, ICEP 2024 2024)
The formation of Ag nodule structures from Ag-Si metastable states
(2024 TMS Annual Meeting & Exhibition 2024)
2006/08 - 米国金属学会 ASM International Metallographic Contest 2006 1st place Precipitates with Peculiar Morphology Consisting of a Disk-Shaped Amorphous Core