文献
J-GLOBAL ID:201602219582812933
整理番号:16A1065940
TSVのための欠陥に誘起された熱機械的応力に関する調査【Powered by NICT】
Investigation on the defect induced thermal mechanical stress for TSV
著者 (5件):
Li Fei
(State Key Laboratory of High Perfonnance Complex Manufacturing and School of Mechanical and Electronical Engineering, Central South University, Changsha, 410083, China)
,
Xiao Chengdi
(State Key Laboratory of High Perfonnance Complex Manufacturing and School of Mechanical and Electronical Engineering, Central South University, Changsha, 410083, China)
,
He Hu
(State Key Laboratory of High Perfonnance Complex Manufacturing and School of Mechanical and Electronical Engineering, Central South University, Changsha, 410083, China)
,
Li Junhui
(State Key Laboratory of High Perfonnance Complex Manufacturing and School of Mechanical and Electronical Engineering, Central South University, Changsha, 410083, China)
,
Zhu Wenhui
(State Key Laboratory of High Perfonnance Complex Manufacturing and School of Mechanical and Electronical Engineering, Central South University, Changsha, 410083, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
ICEPT
ページ:
713-715
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)