文献
J-GLOBAL ID:201602270534080491
整理番号:16A0652133
RDL漏れを減少させ,剥離問題を解くための高分子表面処理:YE収量増強/学習【Powered by NICT】
Polymer surface treatment to reduce RDL leakage and solve delamination issue: YE: Yield enhancement/learning
著者 (6件):
Huang W. L.
(Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
,
Wong J. J.
(Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
,
Huang Danial
(Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
,
Chang K. P.
(Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
,
Su H. S.
(Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
,
Ku Harry
(Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
ASMC
ページ:
456-459
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)