文献
J-GLOBAL ID:201702212177686066
整理番号:17A1814995
表面フッ素化によるシリコン基板と金属フィルムの間の高い接着強度
Enhanced Adhesion Strength between Silicon Substrate and Metal Film by Surface Fluorination
著者 (3件):
Nishimura Fumihiro
(Department of Materials Science and Engineering, Faculty of Engineering, University of Fukui)
,
Kim Jae-Ho
(Department of Materials Science and Engineering, Faculty of Engineering, University of Fukui)
,
Yonezawa Susumu
(Department of Materials Science and Engineering, Faculty of Engineering, University of Fukui)
資料名:
Chemistry Letters
(Chemistry Letters)
巻:
46
号:
11
ページ:
1643-1645(J-STAGE)
発行年:
2017年
JST資料番号:
S0742A
ISSN:
0366-7022
CODEN:
CMLTAG
資料種別:
逐次刊行物 (A)
記事区分:
短報
発行国:
日本 (JPN)
言語:
英語 (EN)