文献
J-GLOBAL ID:201702284100908017
整理番号:17A1705390
Cu nanoparticle/Bi Snはんだハイブリッド結合に及ぼす熱時効の影響【Powered by NICT】
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
著者 (8件):
Usui M.
(Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan)
,
Usui M.
(Department of Engineering Physics, Electronics and Mechanics, Nagoya Institute of Technology, Nagoya 466-8555, Japan)
,
Satoh T.
(Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan)
,
Kimura H.
(Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan)
,
Tajima S.
(Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan)
,
Hayashi Y.
(Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan)
,
Setoyama D.
(Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan)
,
Kato M.
(Department of Engineering Physics, Electronics and Mechanics, Nagoya Institute of Technology, Nagoya 466-8555, Japan)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
78
ページ:
93-99
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)