文献
J-GLOBAL ID:202002233825185323
整理番号:20A1751287
低および高周波数領域における共形被覆導電性および磁性材料を用いたパッケージレベルEMI遮蔽の評価【JST・京大機械翻訳】
Evaluation of package-level EMI shielding using conformally coated conductive and magnetic materials in low and high frequency ranges
著者 (7件):
Joo Kisu
(Ntrium Incorporation,Hwaseong-si,Gyeonggi-do,Korea)
,
Lee Kyu Jae
(Ntrium Incorporation,Hwaseong-si,Gyeonggi-do,Korea)
,
Jun Sung Hyun
(Ntrium Incorporation,Hwaseong-si,Gyeonggi-do,Korea)
,
Lee Seung Jae
(Ntrium Incorporation,Hwaseong-si,Gyeonggi-do,Korea)
,
Young Jeong Se
(Ntrium Incorporation,Hwaseong-si,Gyeonggi-do,Korea)
,
Park Hyun Ho
(The University of Suwon,Department of Electronic Engineering,Hwaseong,South Korea,18323)
,
Kim Yoon-Hyun
(Ntrium Incorporation,Hwaseong-si,Gyeonggi-do,Korea)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2020
号:
ECTC
ページ:
647-652
発行年:
2020年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)