文献
J-GLOBAL ID:202002287617670957
整理番号:20A1125463
青色半導体レーザを用いたマルチビームレーザクラッディングシステムを用いた純銅基板上の純粋な銅層形成【JST・京大機械翻訳】
Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers
著者 (8件):
Hara Takahiro
(Graduate School of Engineering, Osaka University, Suita, Osaka, Japan)
,
Sato Yuji
(Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan)
,
Higashino Ritsuko
(Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan)
,
Funada Yoshinori
(Industrial Research Institute of Ishikawa, Kanazawa, Ishikawa, Japan)
,
Ohkubo Tomomasa
(Department of Mechanical Engineering, Tokyo University of Technology, Hachioji, Tokyo, Japan)
,
Morimoto Kento
(Graduate School of Engineering, Osaka University, Suita, Osaka, Japan)
,
Abe Nobuyuki
(Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan)
,
Tsukamoto Masahiro
(Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan)
資料名:
Applied Physics. A. Materials Science & Processing
(Applied Physics. A. Materials Science & Processing)
巻:
126
号:
6
ページ:
418
発行年:
2020年
JST資料番号:
D0256C
ISSN:
0947-8396
CODEN:
APHYCC
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)