Fukumoto Shinji

Affiliation and department：
Research theme for competitive and other funds (17)：

2010 - 2011 Development of multi-phase bonding for wafer level processing of 3D system in package
2009 - 2011 Micro-resistance seam welding of bulk metallic glasses
2007 - 2009 Clarification of Coalescence Mechanism of Metal Fillers in Self-Organization Assembly Process
2007 - 2008 Feasibility of fabrication of medical devices made of NiTi alloy by small-scale joining processes
2005 - 2008 Surface modification for corrosion resistance to acidic solutions on magnesium alloys with forming fluoride films

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Papers (32)：

Michiya Matsushima, Kei Endo, Tetsuya Kawazoe, Shinji Fukumoto, Kozo Fujimoto. Effect of stress gradient on heat cycle fatigue life prediction of solder joints by repetitive bending test. Materials Science Forum. 2021. 1016 MSF. 875-881
Effective Factors on the Reliability Evaluation of Electronics Joint with Repetitive Bending Test. Proceedings of JIEP Annual Meeting. 2018. 32. 372-375
Michiya Matsushima, Yuta Kato, Yusuke Takechi, Shinji Fukumoto, Kozo Fujimoto. Metal Surface Condition Effect on Interfacial Property between Metal and Epoxy Resin. JOURNAL OF THE JAPAN INSTITUTE OF METALS. 2017. 81. 3. 109-114
Michiya Matsushima, Yuta Kato, Yusuke Takechi, Shinji Fukumoto, Kozo Fujimoto. Effects of Metal Surface Conditions on Interfacial Characteristics between Metal and Epoxy Resin. MATERIALS TRANSACTIONS. 2016. 57. 6. 881-886
Thermal and Mechanical Properties of Conductive Resin Joint with Surface Processing on Metals. Proceedings of JIEP Annual Meeting. 2015. 29. 111-112

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MISC (153)：

KOYAMA Shinji, FUKUMOTO Shinji, PARK Seunghwan. A Preface Technical Information -Special Issue - Frontiers of Surface Modification Technology. JOURNAL OF THE JAPAN WELDING SOCIETY. 2022. 91. 3. 180-180
屋金崚太, 松嶋道也, 福本信次. Liquid Phase Infiltration Bonding of Copper Using Low Melting Point Metal and Porous Sheet. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th
多田剛志, 石原佑真, 松嶋道也, 寺岡巧智, 中村健太, 萬田哲史, 見島雄太, 杉田卓也, 藤本公三, 福本信次. Robot Soldering with Control of Bonding Temperature by Operating Parameters. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th
中村光希, 松嶋道也, 福本信次. Low Temperature Bonding of Copper by Electrodeposition. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th
辻直生, 小倉翔太郎, 松嶋道也, 藤本公三, 福本信次. Convex Shape Formation on Copper Substrate Surface using Cold Spray Process. Symposium on Microjoining and Assembly Technology in Electronics. 2021. 27th

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