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J-GLOBAL ID：200901033628152075 Update date: Apr. 13, 2024

Takahashi Yasuo

タカハシヤスオ | Takahashi Yasuo

Affiliation and department：

Research field (3)： Material fabrication and microstructure control , Structural and functional materials , Electronic devices and equipment

Research keywords (11)： Mg-air battery , Environmental resources , エコプロセス , エコデザイン , カーエレクトロニクス , 電子実装 , Low Environmental Burden , Car electronics , Electronics packaging , Eco-design , Eco-process

Research theme for competitive and other funds (27)：

2014 - 2017 Control of interfacial nanostructure between wide-gap semiconductors and their electrodes
2012 - 2014 Control of Interfacial Strain between Wide-Bandgap Semiconductor and Electrode to Improve Interfacial Electrical Conductance
2009 - 2011 Improvement of Interfacial Functions in Eco-devices Based on Control of Interfacial Nanostructure
2006 - 2008 Analysis of interface-bond formation mechanism of environmentally friendly electronic device wiring and optimization of the bonding process
2005 - 2007 環境調和パワーデバイスインターコネクション形成に関する研究

2005 - 2007 Interconnection and microjoining of the next genaration ecological electronic devises

2004 - 2007 環境低負荷電子実装

2004 - 2006 Ecological Electronics Assembly for Control units of Eco Car

2002 - 2004 Micro-interface formation control of electronic devises based on analysis of solid state bonding mechanism

1998 - 2000 Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.

1995 - 1997 Micro-thermocompression Bonding Mechanism and Modeling for Electronics Devise Interconnection

1995 - 1996 Widening of the joined interface by the procedure without heating and pressing

1993 - 1994 Detecting System of Weld Joint by Image Measurement

1991 - 1993 Low damage cutting and bonding process of high performance composite materials and its systematizing

1992 - 1992 プラズマ窒化プロセスに及ぼすイオン化と発熱効果に関する研究

1992 - 1992 エキシマレーザによる高分子材料の加工

1987 - 1989 Analysis of the formation process of the bonded area in the solid state bonding and its prediction

環境調和先進固相微細(マイクロ)接合

カーエレクトロニクス実装・接合技術の最適化

微細接合とエレクトロニクス実装

環境低負荷微細接合とその最適化

環境低負荷表面改質・成膜プロセス

固相接合機構の解明とその最適化

Micro joining and Electronic Packaging

Thin film formation and Surface modification

Micro-joining process in Electronics

Analysis and optimization of solid state bonding process

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Papers (224)：

Y. Takahashi, M. Tsutaoka, and M. Maeda. Effect of SiC crystal orientation on Ti3SiC2 formation between SiC and Al/Ti bi-layered film. Ceramics International. 2021. 47. 7753-7763
M. Muramatsu, S. Uchida, Y. Takahashi. Noncontact Detection of Concrete Flaws by Neural Network Classification of Laser Doppler Vibrometer Signals. Engineering Research Express. 2020. 2. 25017
Yasuo Takahashi, Kazumasa Takashima, Kouta Misawa, Yusuke Takaoka. In-Situ Observation of Adhesion Behavior during Ultrasonic Al Ribbon Bonding. MDPI Appl. Sci. 2019. 9. 1835. 1-14
Y. Takahashi, M. Arai, M. Maeda. Ternary Ti-Si-C alloy film formation on GaN and contact properties. Ceramics International. 2019. 45. 7, PartB. 9359-9362
Zhonghao Heng, Shigeaki Uchida, Keijirou Itakura, Yasuo Takahashi. Performance Boost for Mg-Air Batteries Based on Felt Separators and Composite Cathodes. Proceeding of 25th Symposium on Microjoining and Assembly Technology in Electronics (MATE 2019). 2019. 25. 379-382

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MISC (82)：

Y.Takahashi, K.Takashima, K.Misawa, Y.Takaoka. In-situ Observation of Adhesion Behavior during Ultrasonic AL Ribbon Bonding. 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), Todaiji Culture Center, Nara, Japan. 2018
Shigeaki Uchida, Yasuo Takahashi. Smart Optical Device of Optical Wave Phase Conjugation for Space Debris Mitigation. BIT's 2nd Annual World Congress of Smart Materials-2016, Shingapore. 2016
土田啓介, Aiman bin Mohd Halil, 前田将克, 高橋康夫. 通電熱処理によるp型窒化ガリウムのアクセプター活性化とコンタクト特性改善. (一社)溶接学会平成27年度秋季全国大会, 札幌. 2015
三澤浩太, 高嶋万将, 高岡勇介, 高橋康夫, 前田将克. 超音波接合におけるAlリボン接合界面の進展挙動. (一社)溶接学会平成27年度秋季全国大会, 札幌. 2015
梨木悠介, 衡中皓, 高橋康夫, 前田将克. 超塑性材料の固相接合におけるマイクロボイド消失機構. (一社)溶接学会平成27年度秋季全国大会, 札幌. 2015

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Patents (12)：

半導体装置の製造方法
Method of Forming an Ohmic Contact on a P-Type 5H-SiC Substrate
Semiconductor Devices and Manufacturing Method Thereof
Method of Manufacturing Semiconductor Devices
超音波接合方法及び装置

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Books (5)：

想創技術社会 -サステイナビリティ実現に向けて-
大阪大学出版会 2016 ISBN:9784872595406
マイクロ接合・実装技術
(株)産業技術サービスセンター 2012 ISBN:9784915957888
サステイナビリティ・サイエンスを拓く
大阪大学出版会 2011 ISBN:9784872593846
「LSIコンタクト,配線」,レアメタル便覧
丸善 2011 ISBN:9784621082768
Numerical Modeling of Solid State Bonding Based on Fundamental Bonding Mechanisms ---For Bonding between Dissimilar Materials---
Ceramic Transaction 2003

Lectures and oral presentations (11)：

研究委員会活動史/溶接学会90周年を迎えて
(第100回界面接合研究委員会 2015)
Micro Ultrasonic Bump Bonding Applied to Eco Electronics Packaging
(International Conference on Innovative Technoligies IN-TECH2015 2015)
微細熱圧着 / 超音波接合機構
(マイクロ接合研究委員会 2015)
界面接合・インターコネクション形成技術
(第99回界面接合研究委員会 2015)
Interconnects & Micro joining in Eco Electronics Packaging
(Welding Research Institute,Xi'an Jiaotong University 2014)

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Works (25)：

ナノスケール構造解析に基づく環境調和デバイス界面の高機能化
2011 -
環境調和型電子デバイス配線接合界面形成機構解析とその最適化
2008 -
Analysis of wiring bonding and formation mechanism of environmentally friendly electronic device
2008 -
電子実装用新低温固相接合技術開発
2007 -
Development of new low temperature solid state bonding technology for electronic assembly
2007 -

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Education (4)：

- 1981 Osaka University
- 1981 Osaka University Graduate School, Division of Engineering
- 1976 Osaka University School of Engineering
- 1976 Osaka University Faculty of Engineering

Professional career (2)：

Dr. of Eng. (Osaka University)
High temperature Creep of an Austenitic 25Cr-20Ni Stainless Steel

Work history (2)：

2011 - - 大阪大学・接合科学研究所・教授
2011 - Joining and Welding Research Institute, Osaka University

Committee career (4)：

2012/04 - 2016/03 溶接学会界面接合研究委員会委員長
1999 - 2011 溶接学会界面接合研究委員会副委員長
2002 - 2005 溶接学会マイクロ接合研究委員会委員長
1998 - 2002 溶接学会マイクロ接合研究委員会副委員長

Awards (25)：

2018/08 - Best Paper of The Year Award (The Electronic and Photonic Packaging Division)
2014/09 - 大阪大学接合科学研究所接合科学共同利用・共同研究賞
2013/11 - the MJITT-JUC Joint International Symposium 2013 Best Paper Award
2008/05 - 溶接学会業績賞
2008 - Japan Welding Society Achievement Award

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Association Membership(s) (4)：

高温学会 , 金属学会 , 溶接学会 , Japan Welding Society

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