Research theme for competitive and other funds (25)：
2020 - 2023 ビッグデータからの材料特性の高速モデル学習と最適化
2016 - 2018 Structural material joining utilizing stress migration
2012 - 2017 Science of Hetero-Interface of Advanced Power Devises in Extreme Environments
2009 - 2013 Tin whisker growth mechanism in aerospace electronics and its mitigation
2011 - 2012 Room temperature and ambient condition joint materials fabrication with metal nano-inks
2008 - 2011 Development of Artificial Tactile Communication system for Tangible Android
2010 - 2010 プリンテッド・エレクトロニクス技術を用いたバイオナノファイバー基板の開発
2010 - 2010 電子デバイス実装技術におけるセルロースナノファイバー補強導電性接着剤の開発
2005 - 2008 Synthesis of mono-dispersed metallic nanoparticles and its application to electronics wiring
2004 - 2005 微細回路パターン用金属ナノ粒子ペーストの開発及び焼結過程解析
2001 - 2003 PREVENTION OF FORMATION OF SOLIDIFICATION DEFECTS LOR LEAD-FREE SOLDERING
2001 - 2002 Nanostructure Determination and Properties of New Atomic Harmonized Materials
1999 - 2000 Direct Atomic Structure-Analysis and Properties of New Nano- and Solid-Clusters
1998 - 1998 多孔質セラミックスのマシナブル化によるセラミックス複合体ニアネット製造
1997 - 1998 Improvement of mechanical properties of short fiber reinforced
1996 - 1997 A Research on Multi-functional Ceramic Based Nanocomposites
1996 - 1996 高次機能調和材料の設計・創成と評価
1986 - 1987 Production of rapidly solidified Fe-C-Si bulk materials by plasma-spraying and their characterization
1983 - 1983 超高圧力を利用したセラミックスと金属の接合
プリンテッドエレクトロニクス
鉛フリー実装技術に関する研究
異種材料接合に関する研究
Printed Electronics
Lead-free electronics soldering
Joining of Dissimilar Materials
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Papers (749)：
Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hiroki Seto, Kei Hashizume, Yuhei Kitahara, et al. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate. Applied Surface Science. 2024. 678. 161128-161128
Sangmin Lee, Seungyeop Baek, Seung-Joon Lee, Chuantong Chen, Masahiko Nishijima, Katsuaki Suganuma, Hiroshi Utsunomiya, Ninshu Ma, Ha-Young Yu, Dongjin Kim. Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding. Materials Science and Engineering: A. 2024. 915. 147178-147178
Koji S. Nakayama, Masahiko Nishijima, Yicheng Zhang, Chuantong Chen, Minoru Ueshima, Katsuaki Suganuma. Metastable phases of Ag-Si: amorphous Si and Ag-nodule mediated bonding. Scientific Reports. 2024. 14. 1
Fupeng Huo, Chuantong Chen, Zheng Zhang, Yicheng Zhang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma. Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module. Materials Characterization. 2024. 114360-114360
Chuantong Chen, Aiji Suetake, Fupeng Huo, Dongjin Kim, Zheng Zhang, Ming-Chun Hsieh, Wanli Li, Naoki Wakasugi, Kazutaka Takeshita, Yoshiji Yamaguchi, et al. Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability. IEEE Transactions on Power Electronics. 2024. 39. 9. 10638-10650
ZHANG Zheng, 末武愛士, LIU Ran, 西嶋雅彦, 奥村理恵子, 加賀美紀子, CHEN Chuantong, 瀬戸寛生, 橋爪佳, 長谷川典彦, et al. Low-pressure 20 μm Copper Micro-bump Bonding through Silver Metallization Layer for Advanced Packaging. マイクロエレクトロニクスシンポジウム論文集. 2023. 33rd
菅沼克昭, HSIEH Ming-chun, ZHANG Zheng, 西嶋雅彦, 末武愛司, CHEN Chuantong, LI Wangyun, 吉田浩芳. Reliability of Advanced Semiconductor Substrates and Their Evaluation Methods. Symposium on Microjoining and Assembly Technology in Electronics. 2023. 29th
HSIEH Ming-chun, ZHANG Zheng, NISHIJIMA Masahiko, YEON Jeyun, SUETAKE Aiji, CHEN Chenchuantong, YOSHIDA Hiroyoshi, KAN Toshiyuki, HONNMA Hidekazu, MATSUNAMI Takushi, et al. Microstructural Characterization of Weak Micro-Via by Electron Microscopy. マイクロエレクトロニクスシンポジウム論文集. 2022. 32nd
Sinter Joining Technology for WBG
(21th International Symposium on Eco-Materials Processing and Design 2020)
Ceramics to metal joining for next generation power devices
(Advanced Ceramics and application VIII; New Frontiers in Multifunctional Material Science and Processing 2019)
Nanomaterials Development at ISIR for IoT Sensing Devices and their Applications
(2019 IEEE 9th International Conference on Nanomaterials: Applications & Properties 2019)
Printed wiring and transparent electrode technology for flexible display
(International Symposium on Advanced Display Materials and Devices 2019)
Ceramics to metal joining for next generation power devices
(43rd International Conference and Exposition on Advanced Ceramics and Composites 2019)
