Nishikawa Hiroshi

ニシカワヒロシ | Nishikawa Hiroshi

Affiliation and department：
Job title： Professor

Research field (4)： Composite materials and interfaces , Material fabrication and microstructure control , Electronic devices and equipment , Manufacturing and production engineering

Research keywords (6)：エレクトロニクス実装 , 微細接合 , はんだ付 , 界面反応 , Nano-& Micro-joining , Green electronics

Research theme for competitive and other funds (8)：

2019 - 2022 Low-temperature bonding using nanostructure on material surface
2016 - 2019 Bonding process for sintered layer with high thermostability using a nanoporous structure
2013 - 2016 Microjoining technology using sintering process of 3D nanoporous structure
2011 - 2013 フレキシブルデバイス向け高信頼性Cu粒子含有導電性接着剤の開発
2010 - 2012 Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the joint

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Papers (490)：

Ichizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi, Hiroshi Nishikawa. Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression. Journal of Electronic Materials. 2024
Chuncheng Wang, Hiroaki Tatsumi, Hiroshi Nishikawa. Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal-organic decomposition. Journal of Materials Science. 2024
Soichi Homma, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, Hiroshi Nishikawa. Quanifification of Adhesion Strength and Mechanism of Adhesion Degradation between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages. Proceeding of the 10th IEEE Electronics System-Integration Technology Conference. 2024. MIP4_2
Hiroshi Nishikawa, Yuki Hirata, Shiqi Zhou, Chih-han Yang, Shih-kang Lin. Effect of minor element addition on mechanical properties and microstructure of Sn-Bi alloys. Proceeding of the 10th IEEE Electronics System-Integration Technology Conference. 2024. MIP4_3
平瀬加奈, 巽裕章, 西川宏. ロータス型ポーラス銅/はんだ複合接合部の熱伝導率評価. 第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集. 2024. 123-126

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MISC (215)：

Hiroshi Nishikawa, Byun Park. Solid-state bonding using nanoporous Cu sheet on Au surface-finishing for power devices. International conference and Exhibition High Temperature Electronics Network (HiTEN2024), Edinburgh. 2024
Hiroaki Tatsumi, Shunya Nitta, Atsushi M Ito, Arimichi Takayama, Hiroshi Nishikawa. Interfacial energy assessment of Cu/Si3N4 joints for power electronics substrate. IIW Annual Assembly and International Conference (IIW 2024),. 2024
Hiroaki Tatsumi, Yuki Kida, Keisuke Takenaka, Seiji Kaneshita, Yuji Sato, Masahiro Tsukamoto, Hiroshi Nishikawa. Microstructure and strength of Sn-Ag-Cu solder joint using blue diode laser. TMS2024 Annual Meeting & Exhibition,. 2024
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa. Bonding strength of ENIG joint using micro-sized Ag particles with submicron ceramic particles. TMS2024 Annual Meeting & Exhibition,. 2024
Shunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa. Tensile strength of Sn-In Eutectic Solder with Surface Modified ZrO2 Nanoparticles. The Advanced Materials Research Grand Meeting (MRM2023/IUMRS-ICA2023), Kyoto, Japan. 2023

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Patents (11)：

低温接合方法及び接合体
銅粒子を用いた低温接合方法
ナノポーラスめっき構造体とそれを用いた接合技術
マイクロサイズ粒子を用いた無加圧下での接合技術
プリコートしたマイクロサイズ粒子を用いた接合技術

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Books (8)：

標準マイクロソルダリング技術第4版
日刊工業新聞社 2024 ISBN:9784526083280
次世代パワー半導体の熱設計と実装技術
シーエムシー出版 2020 ISBN:9784781314365
Novel Structured Metallic and Inorganic Materials
Springer 2019 ISBN:9789811376108
導電性フィラー,導電助剤の分散性向上,評価,応用
(株)技術情報協会 2015 ISBN:9784861045837
エポキシ樹脂の"特性改良"と"高機能/複合化"技術
(株)技術情報協会 2015 ISBN:9784861045707

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Lectures and oral presentations (63)：

New Wave of Electronic Packaging: Low-Temperature Solder and its Impacts
(The International Union of Materials Research Societies - 18th International Conference on Electronic Materials 2024 (IUMRS-ICEM 2024) 2024)
Potential of low temperature soldering using hypoeutectic Sn-Bi alloys
(7th International Conference on Advanced Electromaterials 2023)
Solid-phase bonding process using nanostructured surface for power devices in automotive
(17th International Conference Reliability and Stress-Related Phenomena in Nanoelectornics (IRSP 2023) 2023)
Solid-phase bonding using nanostructured surface for power devices
(Seminar between IMS-VAST and JWRI-OU 2023)
Die bonding process using nanostructured surface for power devices
(International Welding/Joining Conference-Korea 2022 2022)

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Education (3)：

1999 - 2002 大阪大学大学院工学研究科知能・機能創成工学専攻博士後期課程
1997 - 1999 大阪大学大学院工学研究科知能・機能創成工学専攻博士前期課程
1993 - 1997 Osaka University School of Engineering

Professional career (2)：

Master (Osaka University)
Docter (Osaka University)

Work history (5)：

2018/04 - 現在 Osaka University Joining and Welding Research Institute Professor
2007/04 - 2018/03 Osaka University Joining and Welding Research Institute
2006/08 - 2007/03 Osaka University Joining and Welding Research Institute
2005/01 - 2006/07 Osaka University Joining and Welding Research Institute Assistant Professor
2002/04 - 2004/12 Osaka University Graduate School of Engineering Assistant Professor

Awards (19)：

2024/01 - (一社)スマートプロセス学会エレクトロニクス生産科学部会、(一社)溶接学会マイクロ接合研究委員会 Mate2024優秀論文賞
2023/11 - (一社)スマートプロセス学会論文賞
2022/03 - グローバル人材育成教育学会 2021年度論文賞
2019/11 - 大阪大学大阪大学賞大学運営部門
2019/05 - (一社)レーザー学会業績賞(論文賞)

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Association Membership(s) (8)：

エレクトロニクス実装学会 , 溶接学会 , IEEE , TMS , スマートプロセス学会 , 日本接着学会 , 日本機械学会 , 日本金属学会

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