Rchr
J-GLOBAL ID:200901091638002403   Update date: Jun. 11, 2024

Suzuki Ken

スズキ ケン | Suzuki Ken
Affiliation and department:
Job title: Professor
Homepage URL  (2): http://db.tohoku.ac.jp/whois/detail/0ffeeb2e93ab6176d9fa1cdb2f8026c6.htmlhttp://db.tohoku.ac.jp/whois/e_detail/0ffeeb2e93ab6176d9fa1cdb2f8026c6.html
Research field  (1): Machine materials and mechanics
Research theme for competitive and other funds  (16):
  • 2020 - 2023 Strain-Controlled Graphene-Nanoribbon-Base Biochemical Sensors with High Selectivity and Sensitivity
  • 2020 - 2023 ひずみ制御によるグラフェンナノリボン電子構造設計手法の構築と多機能センサへの応用
  • 2016 - 2021 Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of Materials
  • 2017 - 2020 Solid phase film formation of polymer/ceramic compound particles by hetero-structure control and comprehensive analysis of film formation mechanisms
  • 2017 - 2019 Degradation Analysis of Engineering Materials in Air Using White Light and Precise Optical Filter
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Papers (279):
  • Meng Yin, Xiangyu Qiao, Lei Wang, Hideo Miura, Ken Suzuki. Strain-modulated adsorption of gas molecule on graphene: First-principles calculations. Diamond and Related Materials. 2024. 142
  • Lei Wang, Ya Ning Sun, Xian Deng Wei, Meng Yin, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang. The uniaxial zero thermal expansion and zero linear compressibility in distorted Prussian blue analogue RbCuCo(CN)6. Physical Chemistry Chemical Physics. 2023. 25. 48. 32845-32852
  • Lv Yi Cheng, Run Zi Wang, Kai Shang Li, Hai Long Guo, Le Xu, Ken Suzuki, Hideo Miura, Xian Cheng Zhang, Shan Tung Tu. Geometric discontinuity effect on creep-fatigue behaviors in a nickel-based superalloy hole structure considering ratcheting deformation. International Journal of Fatigue. 2023. 175
  • Le Xu, Run Zi Wang, Yu Chen Wang, Lei He, Takamoto Itoh, Ken Suzuki, Hideo Miura, Xian Cheng Zhang. Microstructural evolutions and life evaluation of non-proportional creep-fatigue considering loading path and holding position effects. Materials Characterization. 2023. 204
  • Yifan Luo, Yukako Takahashi, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura. Acceleration mechanism of the degradation of the lifetime of Ni-based superalloys under creep-fatigue loading at elevated temperatures. Fatigue and Fracture of Engineering Materials and Structures. 2023. 46. 8. 3043-3059
more...
MISC (172):
  • TAKAHASHI Motoki, SUZUKI Ken, MIURA Hideo. 120 Investigation of the Dominant Factor of Degradation of Ni-based Super Alloy Considering the Change of Atomic Configuration. 2016. 2016. 51. 37-38
  • Murakoshi Takuya, Suzuki Ken, Miura Hideo. 119 Damage Mechanism of Heat-Resistant Material Caused by the Change of Its Micro Texture Under Mechanical Loading at High Temperature. 2016. 2016. 51. 35-36
  • NAKANISHI Takahiro, ICHIKAWA Yuji, SUZUKI Ken, MIURA Hideo. 144 Development of the Measurement method of the Strength of a Grain Boundary. 2016. 2016. 51. 85-86
  • KATO Takeru, SUZUKI Ken, MIURA Hideo. 136 Clarification and Control of the Multiple factors for the Long-term Reliability of the Sub-micro-size Copper Thin-film Interconnections. 2016. 2016. 51. 69-70
  • LIU Jiatong, SUZUKI Ken, MIURA Hideo. 138 Effect of the Crystallinity of Underlayer Material on Microtexture of electroplated Copper thin Film. 2016. 2016. 51. 73-74
more...
Books (2):
  • 自動車用電気二重層キャパシタとリチウムイオン二次電池の高エネルギー密度化・高出力化技術
    技術情報協会 2005
  • コンビナトリアルサイエンスの新展開
    シーエムシー出版 2002
Professional career (1):
  • Ph.D. in Engineering (Tohoku University)
Awards (6):
  • 2013/03 - エレクトロニクス実装学会 Outstanding Technical Paper Award of International Conference on Electronic Packaging
  • 2011/07 - ASME Best Paper Award of ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS
  • 2009/07 - ASME ASME INTERNATIONAL InterPACK ’09 Best Poster
  • 2009/04 - Japan Institute of Electronics Packaging International Conference on Electronics Packaging Outstanding Technical Paper Award
  • 2007/07 - ASME Outstanding Paper Award of Packageing Material and Process Track
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Association Membership(s) (3):
日本材料学会 ,  応用物理学会 ,  Japan society of mechanical engineers
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