Research field (5):
Machine elements and tribology
, Design engineering
, Machine materials and mechanics
, Material fabrication and microstructure control
, Manufacturing and production engineering
Research keywords (14):
はんだ
, 鉄鋼
, 表面改質
, ろう付
, 接合
, 金属材料
, 機械加工
, solder
, iron and steel
, surface modification
, brazing
, joining
, metallic material
, machining
Research theme for competitive and other funds (9):
2020 - 2024 金属塩の生成・分解挙動の可視化とマルチマテリアル造形技術への応用
2017 - 2020 Creation of low temperature sinterable metal nanoparticles and application to precision assembly and joining
2015 - 2017 Fabrication of high plateau stress and wide plateau region porous aluminum
2014 - 2017 Development of metal salt coated insert sheet and their application to low temperature precise bonding
2012 - 2016 Producing high functional resin/metal heterogeneous interface for SiC power devices
2012 - 2014 A study of low-temperature bonding of electronic device by using organic salt formation/decomposition reaction
2013 - 反応拡散現象による金属表面の耐食・耐摩耗性向上技術の開発
2013 - 反応拡散現象による金属表面の耐食・耐摩耗性向上技術の開発
2009 - 2011 Study on hybridization of thermal exchanging system for power semiconductor device
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Papers (46):
Yoshihiko Hangai, Tatsuki Takagi, Shinji Koyama, Ryosuke Suzuki, Yuichiroh Kamakoshi. Refoaming of deformed aluminum foam fabricated by precursor foaming process using remaining foaming agent and densification using friction stir welding. Materials Letters. 2023. 351
Shinji Koyama, Ikuo Shohji, Takako Muraoka. Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid. MATERIALS TRANSACTIONS. 2022
Shinji Koyama, Ikuo Shohji, Takako Muraoka. Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications. MATERIALS TRANSACTIONS. 2022. 63. 6. 813-820
Tong Chen, Shinji Koyama, Shinichi Nishida, Lihua Yu. Mechanical Properties and Frictional Wear Characteristic of Pure Titanium Treated by Atmospheric Oxidation. Materials (Basel, Switzerland). 2021. 14. 12
WANG Tiancheng, KOYAMA Shinji, NAKAHIRA Kenji, USUDA Tsuyoshi Sasaki. Error Performances and Robust Design Criteria for Quantum Receiver in the Presence of Phase Noise. 2022. J105-B. 3. 39-51
山坂健登, 小山真司. Effect of Bonding Surface Properties on A1070/C1020 Solid-Phase Bonding Using Electrically Assisted Bonding Method. Symposium on Microjoining and Assembly Technology in Electronics. 2022. 28th
小山真司. Report on welding.マルチマテリアル化を支える接合技術-各種拡散接合法のキーポイント-. Jitsu, Ten. 2022. 327