Research field (1)：
Electronic devices and equipment
Research theme for competitive and other funds (12)：
2022 - 2027 Realization of innovative non-reciprocal integrated-circuit devices using SIS mixers
2022 - 2025 High-speed measurement of silicon spin qubits using a Josephson parametric amplifier
2019 - 2024 Creation of extremely energy-efficient integrated circuit technology beyond the thermodynamic limit based on reversible quantum flux circuits
2020 - 2023 Superconducting qubits and current standard devices using self-duality
2018 - 2023 Research on Ultra-Low-Power Sub-terahertz Superconductor Quantum Digital Systems Based on Pulse-Driven Circuit Technology
2017 - 2020 Development of an innovative evaluation method for superconducting devices due to phase transition on two-dimensional superconductors
2016 - 2019 New devices based on duality picture of superconductor- insulator transitions on Superconducting nanowire
2014 - 2018 Development of single-photon imaging technology based on large-scale SSPD array
2014 - 2017 Study of low-noise superconducting parametric amplifier aiming at sensitivity enhancement of terahertz receivers
2014 - 2017 Research on highly sensitive terahertz detector aiming at quantum noise limit
2014 - 2017 Development of tandem type on-demand superconducting device of oxide degenerate semiconductor / nitride superconductor
2011 - 2013 Physical properties of optimization and control of nitride superconducting thin films for superconducting device applications
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Papers (91)：
Fusao Ichikawa, Hiroki Takeda, Kohei Matsuo, Kazumasa Makise, Bunju Shinozaki. Nitrogen Dependence of Superconducting Properties in MoReN Thin Films. Proceedings of the 29th International Conference on Low Temperature Physics (LT29). 2023
Wei Feng, Katsuya Kikuchi, Mutsuo Hidaka, Hirotake Yamamori, Yuuki Araga, Kazumasa Makise, Shiro Kawabata. Investigation of heat transfer in 3D packaging for practical-scale quantum annealing machines. 2021 International Conference on Electronics Packaging, ICEP 2021. 2021. 163-164
Wei Feng, Katsuya Kikuchi, Mutsuo Hidaka, Hirotake Yamamori, Yuuki Araga, Kazumasa Makise, Shiro Kawabata. Thermal management of a 3D packaging structure for superconducting quantum annealing machines. Applied Physics Letters. 2021. 118. 17
