Research field (4):
Electronic devices and equipment
, Manufacturing and production engineering
, Thin-film surfaces and interfaces
, Nano/micro-systems
Research keywords (1):
Heterogeneous integration&packaging, Room temperature bonding, Hybrid bonding, Co-packged photonics Surface cleaning technology, RF photonics, LNOI, X-material on insulator, Bump boinding , Passive alignment、MEMS packaging