Research field (5)：
Manufacturing and production engineering
, Inorganic materials
, Electric/electronic material engineering
, Manufacturing and production engineering
, Composite materials and interfaces
Research theme for competitive and other funds (4)：
2022 - 2024 Development of Wide-band X-ray gamma-ray and optical-infrared integrated imaging devices by Japan's Original Surface-Activated Wafer Bonding Technology
2022 - 2024 オールダイヤモンド冷却構造のための微細加工法および最適構造の探索
2020 - 2022 Low-temperature direct bonding of beta-Ga2O3/diamond for advanced power electronics
2019 - 2022 Research about ultra-high hermetic seal bonding for microcavity by quantum sensing
Papers (84)：
Yuichi Kurashima, Atsuhiko Maeda, Naoto Oshima, Taisei Motomura, Takashi Matsumae, Mitsuhiro Watanabe, Hideki Takagi. Ultra-High Vacuum Cells Realized by Miniature Ion Pump Using High-Efficiency Plasma Source. Sensors. 2024
Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Takahiro Tsuda, Tomoaki Tokuhisa, Toshikazu Shimizu, et al. Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 129-130
Takashi Matsumae, Sho Okita, Shoya Fukumoto, Masanori Hayase, Yuichi Kurashima, Hideki Takagi. Hydrophilic Bonding of GaN and Diamond Substrates. ECS Meeting Abstracts. 2023
Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Tomoaki Tokuhisa, Toshikazu Shimizu, Eiji Higurashi. Template Stripping of Au from Polyimide Film for Smoothing of Bonding Surface. 2023 IEEE CPMT Symposium Japan (ICSJ). 2023
Takashi Matsumae, Sho Okita, Shoya Fukumoto, Masanori Hayase, Yuichi Kurashima, Hideki Takagi. Hydrophilic Bonding of GaN and Diamond Substrates. ECS Transactions. 2023
小関奨吾, 荻野美佳, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 津田貴大, 清水寿和, 徳久智明, et al. Surface smoothing of Au plated films by template stripping using polyimide films. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2024. 38th
松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 渡邊幸志, 伊藤利充, 日暮栄治. For efficient heat dissipation from ultra-widegap Ga2O3 substrate by direct bonding with diamond substrate. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2022. 36th
松前貴司, 倉島優一, 高木秀樹, 白柳裕介, 檜座秀一, 西村邦彦, 日暮栄治. Room-temperature bonding of GaN/diamond through atomically thin intermediate layer. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2022. 36th
松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 日暮栄治. Direct bonding formation between semiconductor device and diamond substrate via reaction of surface functional groups. 電子情報通信学会大会講演論文集(CD-ROM). 2022. 2022
倉島優一, 柳町真也, 松前貴司, 前田敦彦, 高木秀樹, 日暮栄治. Low Temperature Bonding of Si and Sapphire for a Gas Cell of Miniature Atomic Clock. マイクロエレクトロニクスシンポジウム論文集. 2021. 31st
2014 - 2017 The University of Tokyo School of Engineering Department of Precision Engineering
2012 - 2014 The University of Tokyo School of Engineering Department of Precision Engineering
2008 - 2012 The University of Tokyo School of Engineering Department of Precision Enginerring
Work history (2)：
2017/04 - 2021/03 National Institute of Advanced Industrial Science and Technology Research Center for Ubiquitous MEMS and Micro Engineering Researcher
2014/05 - 2015/03 Old Dominion University Applied Research Center Visiting Research Scholar
Committee career (2)：
2020/04 - 現在 精密工学会 学術交流委員会
2018/03 - 現在 エレクトロニクス実装学会 マイクロメカトロニクス実装技術委員
Awards (9)：
2022/12 - 国立研究開発法人 産業技術総合研究所 技術融合アワード
2022/12 - New Diamond and Nano Carbon 2022 Silver Young Scholar Award
2020/10 - The Electrochemical Society Bruce Deal & Andy Grove Young Author Award
2019/05 - 6th International Workshop on Low Temperature Bonding for 3D Integration 2019 Best poster award
2019/03 - 一般社団法人エレクトロニクス実装学会 研究奨励賞
2018/10 - The Electrochemical Society Best paper award
2016/10 - The Electrochemical Society Outstanding student presentation award
2014/04 - The Japan Institute of Electronics Packaging IEEE CPMT JAPAN Chapter Young Award
2012/04 - The Japan Institute of Electronics Packaging JIEP Poster Award
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Association Membership(s) (2)：
The Electrochemical Society
, THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING
