Takeuchi Kai

タケウチカイ | Takeuchi Kai

Affiliation and department：
Job title： Assistant Professor

Research field (1)： Electronic devices and equipment

Research keywords (2)： low temperature bonding , wafer bonding

Research theme for competitive and other funds (5)：

2024 - 2026 Creation of fundamental technology on room-temperature bonding through nano-interface control
2023 - 2026 ナノ界面制御による常温接合基盤技術の創出
2023 - 2026 常温接合技術に基づく耐腐食性接合界面の創出
2021 - 2024 高出力用光学素子実装のための直接接合技術の開発
2021 - 2022 光学素子実装のための酸化アルミニウム中間層を介したガラス材料の常温透明接合

Papers (47)：

Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Takahiro Tsuda, Tomoaki Tokuhisa, Toshikazu Shimizu, et al. Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 129-130
Daiki Nemoto, Kai Takeuchi, Eiji Higurashi. Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 289-290
Mika Ogino, Kai Takeuchi, Eiji Higurashi. Influence of Various Plasma and UV/O3Treatments on Au Surfaces for Au-Au Surface Activated Bonding. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 331-332
Kai Takeuchi, Daiki Nemoto, Tadatomo Suga, Eiji Higurashi. Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 113-114
Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, Eiji Higurashi. Optimization of Ag Thin Film Thickness with a Capping Layer for Ag-Ag Surface Activated Bonding. 2024 International Conference on Electronics Packaging, ICEP 2024. 2024. 117-118

ｍore...

MISC (14)：

小関奨吾, 荻野美佳, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 津田貴大, 清水寿和, 徳久智明, et al. Surface smoothing of Au plated films by template stripping using polyimide films. エレクトロニクス実装学会講演大会講演論文集(CD-ROM). 2024. 38th
Kai Takeuchi. Effect of Water on Wafer Bonding Interface. Journal of The Japan Institute of Electronics Packaging. 2023. 26. 5. 434-440
竹内魁, 日暮栄治, KIM Beomjoon, WANG Junsha, 須賀唯知. Passivation of Activated Au Surface for Low Temperature Bonding. センサ・マイクロマシンと応用システムシンポジウム(CD-ROM). 2023. 40th
古戸颯真, CUI Yuwen, 竹内魁, 山田博仁, 横山弘之, 日暮栄治. 2nd quantized state oscillation in a gain switched 925nm-band QW-LD and its suppression. 応用物理学会秋季学術講演会講演予稿集(CD-ROM). 2023. 84th
日暮栄治, 竹内魁. Progress and future perspective of room-temperature bonding technologies for heterogeneous integration. 電子情報通信学会技術研究報告(Web). 2023. 123. 142(CPM2023 10-22)

ｍore...

Education (3)：

2017 - 2020 The University of Tokyo The Graduate School of Engineering Department of Precision Engineering
2015 - 2017 The University of Tokyo The Graduate School of Engineering Department of Precision Engineering
2011 - 2015 The University of Tokyo The Faculty of Engineering Department of Precision Engineering

Professional career (1)：

Work history (4)：

2022/08 - 現在 Tohoku University Department of Electronic Engineering, Graduate School of Engineering Assistant Professor
2021/10 - 2022/07 The University of Tokyo System Design Lab, School of Engineering Project Researcher
2020/08 - 2022/07 The University of Tokyo Institute of Industrial Science Collaborative Researcher
2020/04 - 2022/07 Meisei University Collaborative Research Center Senior Researcher

Committee career (7)：

Show all

Awards (3)：

2024/03 - 東北大学電気・情報系若手優秀研究賞
2021/10 - The Organizing Committee of 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Best Presentation Award Quantification of Wafer Bond Strength of Silicon Nitride under Controlled Atmosphere
2016/10 - The Electrochemical Society Outstanding Student Paper Award Modified Surface Activated Bonding Using Si Intermediate Layer for Bonding and Debonding of Glass Substrates

Association Membership(s) (4)：

IEEE EPS , The Institute of Electrical Engineers of Japan , エレクトロニクス実装学会 , 精密工学会

※ Researcher’s information displayed in J-GLOBAL is based on the information registered in researchmap. For details, see here.

Return to Previous Page