Suppression of Electro Chemical Migration Generation through Forming Parylene Coating and Improving Adhesion Strength between Polyphthalamide Substrate Used for Molded Interconnection Device and Coated Film
(International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) 2012)
Suppression of Electro Chemical Migration Generation through Forming Parylene Coating and Improving Adhesion Strength between Polyphthalamide Substrate Used for Molded Interconnection Device and Coated Film
(International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) 2012)