Shimatsu Takehito

シマツタケヒト | Shimatsu Takehito

Affiliation and department：
Job title： Professor
Homepage URL (1)： http://www.fris.tohoku.ac.jp/~shimatsu/index.html

Research field (3)： Thin-film surfaces and interfaces , Electronic devices and equipment , Electric/electronic material engineering

Research keywords (6)：超高真空 , 磁性薄膜 , スパッタリングプロセス , 磁気記録媒体 , 原子拡散接合法 , 室温接合技術

Research theme for competitive and other funds (18)：

2008 - 現在原子拡散接合法による室温接合技術の開発とデバイス形成への応用
1990 - 現在 Sputter film deposition process and microstructure of the deposited thin metal films
1989 - 現在 High density perpendicular recording media
2021 - 2024 Research of synthetic antiferromagnet for THz devices with Brillouin light scattering
2020 - 2023 高光透過率で屈折率調整が可能な接合界面を有する完全無機の室温接合技術の開発

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Papers (324)：

M. Uomoto, T. Shimatsu, T. Goto, T. Hanasaki, K. Bando, Y. Suzuki, T. Saito. Atomic diffusion bonding of wafers with PDC-SiO₂ underlayers using thin Y, Sc, and Zr films. Japanese Journal of Applied Physics. 2025. 64. 4. 048001-048001
H. Iemura, M. Uomoto, T. Shimatsu. Blade testing in low-humidity air for bonded interfaces fabricated using atomic diffusion bonding with Zr and Al₂O₃ films. Japanese Journal of Applied Physics. 2025. 64. 3. 038002-038002
K. Noguchi, M. Uomoto, T. Shimatsu. Loading Pressure Effects on the Bonded Interface Structure in Atomic Diffusion Bonding Using Thick Au Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024. 1-1
A. Muraoka, K. Bando, Y. Suzuki, H. Makita, T. Saito, H. Fukunaga, M. Uomoto, T. Shimatsu. Atomic Diffusion Bonding Using SiN Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024. 1-1
H. Iemura, M. Uomoto, T. Shimatsu. Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024. 1-1

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MISC (95)：

菊池伸明, 畑山正寿, 島津武仁, 岡本聡. マイクロ波アシスト磁化反転と磁気的相互作用. 信学技報. 2024. 124. 67. 35-40
島津武仁, 魚本幸. 原子拡散接合法:光デバイス応用に向けた室温・低温接合技術. 月刊オプトロニクス2023年11月号. 2023. 104-107
Takehito SHIMATSU, Miyuki UOMOTO. Atomic Diffusion Bonding : Room Temperature Bonding of Glass Substrates Using Metal, Oxide and Nitride Thin Films. Vacuum and Surface Science. 2022. 65. 10. 454-459
Effect of thermal fluctuations on microwave assisted switching in Co/Pt nanodot array. 2021. 45. 14. 7-11
島津武仁. 原子拡散接合法:真空中の金属膜表面における原子再配列現象を利用した室温接合技術. 真空ジャーナル. 2021. 175. 12-16

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Books (2)：

異種材料一体化のための最新技術 ~溶接・接着剤・一体形成・加飾~
サイエンス&テクノロジー株式会社 2012 ISBN:9784864280365
advanced Technologies of Perpendicular Magnetic Recording
シーエムシー出版 2007

Lectures and oral presentations (349)：

Atomic Diffusion Bonding of Wafers with PDC-SiO<sub>2</sub> underlayers using Thin Zr Films
(WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
Atomic Diffusion Bonding using SiN films
(WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
Bonding Potential of Atomic Diffusion Bonding of Wafers Using Oxide Films
(WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
Loading Pressure Effects on the Bonded Interface Structure in Atomic Diffusion Bonding Using Thick Au Films
(WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films
(WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)

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Education (2)：

- 1988 Tohoku University Graduate School, Division of Engineering 電子工学
- 1986 Tohoku University Faculty of Engineering 電子工学

Professional career (1)：

Ph.D. (Tohoku University)

Awards (21)：

2024/11 - Institute for Advanced Micro-System Integration (IMSI) Best Poster Presentation Awards Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films
2023/10 - The Electrochemiacl Society 244th ECS Meeting Best Student Paper Award Blade Test in Atmospheric-Pressure Ar Gas to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding
2023/10 - The Electrochemiacl Society 244th ECS Meeting Best Paper Award Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study using Ni and Cu Films
2023/09 - 一般社団法人エレクトロニクス実装学会第32回マイクロエレクトロニクスシンポジウム(MES2022)ベストペーパー賞 Cuを微量添加したAg薄膜を用いた大気中の原子拡散接合法における接合性能
2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Atomic Diffusion Bonding using AlN films

2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Surface Contamination Effects on Bonding Performance in Atomic Diffusion Bonding of Wafers using Amorphous Si Thin Films

2019/05 - 191st Committee on Innovative Interface Bonding Technology Japan Society for the Promotion of Science (JSPS) Best Poster Presentation Award, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding

2018/10 - Electrochemical Society (ECS) AiMES 2018 ECS and SMEQ Joint International Meeting Best Paper Award Atomic Diffusion Bonding for Optical Devices with High Optical Density

2018/01/10 - University of New York, Japan Society for thePpromotion of Science Magnetics and Optics Research International Symposium(MORIS 2018) Best Poster Award Frequency dependence of microwave-assisted switching in CoCrPt granular perpendicular media

2016/10/03 - Electrochemical Society (ECS) Best Presentation Award Among Invited Papers, 230th Meeting of The Electrochemical Society (ECS), PRiME 2016, Semiconductor Wafer Bonding 14: Science, Technology and Applications High Output Power Deep Ultraviolet Light-Emitting Diodes with Hemispherical Lenses Fabricated Using Room-Temperature Bonding

2015/07/07 - 一般社団法人エレクトロニクス実装学会第29回エレクトロニクス実装学会春季講演大会優秀賞 Auキャップ付金属薄膜を用いたウエハの大気中室温接合II(Cu, Al 薄膜)

2014/09/04 - 一般社団法人エレクトロニクス実装学会エレクトロニクス実装学会 MES2013 秋季大会研究奨励賞

2014/09/03 - 公益社団法人日本磁気学会日本磁気学会平成26年度優秀研究賞

2014/07/16 - IEEE CPMT Sociey Japan Chapter Best Presentation Award, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Room Temperature Bonding of Wafers in Air using Au-Ag Alloy Films

2014/07/04 - 一般社団法人溶接学会マイクロ接合優秀研究賞(MJ賞) 原子拡散接合法によるウエハの室温接合技術の現状と課題

2013/03/28 - 田中貴金属工業株式会社田中貴金属工業株式会社「貴金属に関わる研究助成金」MMS賞

2012/06/04 - SRC情報ストレージ研究推進機構 SRC情報ストレージ研究推進機構論文賞2011 Frequency and time dependent microwave assisted switching behaviors of Co/Pt nanodts Appl. Phys. Express, 5(2012)043001(1-3)

2012/05/23 - IEEE CPMT Japan Society Best Presentation Award, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Atomic Diffusion Bonding of Wafers in Air with Thin Au Films and Its Application to Optical Devices Fabrication

2011/05 - SRC情報ストレージ研究推進機構 SRC情報ストレージ研究推進機構論文賞2010 Microwave assisted magnetization switching in Co/Pt multilayer, J. Appl. Phys., Vol.109, 07B748(2011)

2010/12 - 財団法人石田記念財団石田記念財団平成22年度研究奨励賞高密度ストレージデバイス用の高磁気異方性薄膜材料の開発

2010/01/19 - 田中貴金属工業株式会社田中貴金属工業株式会社第11回「貴金属に関わる研究助成金」プラチナ賞(大賞) 次世代ストレージ・メモリへの応用に向けたL1<SUB>1</SUB>Co-Pt垂直磁化膜の高性能化

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Association Membership(s) (4)：

米国電気学会磁性分科(IEEE,Magnetics Society) , 日本金属学会 , 日本磁気学会 , エレクトロニクス実装学会

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