Rchr
J-GLOBAL ID:200901036187762580   Update date: May. 02, 2025

Shimatsu Takehito

シマツ タケヒト | Shimatsu Takehito
Affiliation and department:
Job title: Professor
Homepage URL  (1): http://www.fris.tohoku.ac.jp/~shimatsu/index.html
Research field  (3): Thin-film surfaces and interfaces ,  Electronic devices and equipment ,  Electric/electronic material engineering
Research keywords  (6): 超高真空 ,  磁性薄膜 ,  スパッタリングプロセス ,  磁気記録媒体 ,  原子拡散接合法 ,  室温接合技術
Research theme for competitive and other funds  (18):
  • 2008 - 現在 原子拡散接合法による室温接合技術の開発とデバイス形成への応用
  • 1990 - 現在 Sputter film deposition process and microstructure of the deposited thin metal films
  • 1989 - 現在 High density perpendicular recording media
  • 2021 - 2024 Research of synthetic antiferromagnet for THz devices with Brillouin light scattering
  • 2020 - 2023 高光透過率で屈折率調整が可能な接合界面を有する完全無機の室温接合技術の開発
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Papers (324):
  • M. Uomoto, T. Shimatsu, T. Goto, T. Hanasaki, K. Bando, Y. Suzuki, T. Saito. Atomic diffusion bonding of wafers with PDC-SiO2 underlayers using thin Y, Sc, and Zr films. Japanese Journal of Applied Physics. 2025. 64. 4. 048001-048001
  • H. Iemura, M. Uomoto, T. Shimatsu. Blade testing in low-humidity air for bonded interfaces fabricated using atomic diffusion bonding with Zr and Al2O3 films. Japanese Journal of Applied Physics. 2025. 64. 3. 038002-038002
  • K. Noguchi, M. Uomoto, T. Shimatsu. Loading Pressure Effects on the Bonded Interface Structure in Atomic Diffusion Bonding Using Thick Au Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024. 1-1
  • A. Muraoka, K. Bando, Y. Suzuki, H. Makita, T. Saito, H. Fukunaga, M. Uomoto, T. Shimatsu. Atomic Diffusion Bonding Using SiN Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024. 1-1
  • H. Iemura, M. Uomoto, T. Shimatsu. Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). 2024. 1-1
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MISC (95):
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Books (2):
  • 異種材料一体化のための最新技術 ~溶接・接着剤・一体形成・加飾~
    サイエンス&テクノロジー株式会社 2012 ISBN:9784864280365
  • advanced Technologies of Perpendicular Magnetic Recording
    シーエムシー出版 2007
Lectures and oral presentations  (349):
  • Atomic Diffusion Bonding of Wafers with PDC-SiO<sub>2</sub> underlayers using Thin Zr Films
    (WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
  • Atomic Diffusion Bonding using SiN films
    (WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
  • Bonding Potential of Atomic Diffusion Bonding of Wafers Using Oxide Films
    (WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
  • Loading Pressure Effects on the Bonded Interface Structure in Atomic Diffusion Bonding Using Thick Au Films
    (WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
  • Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films
    (WaferBond 2024 EAST 2024 8th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2024) 2024)
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Education (2):
  • - 1988 Tohoku University Graduate School, Division of Engineering 電子工学
  • - 1986 Tohoku University Faculty of Engineering 電子工学
Professional career (1):
  • Ph.D. (Tohoku University)
Awards (21):
  • 2024/11 - Institute for Advanced Micro-System Integration (IMSI) Best Poster Presentation Awards Blade Test to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding with Amorphous Si and Al Films
  • 2023/10 - The Electrochemiacl Society 244th ECS Meeting Best Student Paper Award Blade Test in Atmospheric-Pressure Ar Gas to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding
  • 2023/10 - The Electrochemiacl Society 244th ECS Meeting Best Paper Award Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study using Ni and Cu Films
  • 2023/09 - 一般社団法人 エレクトロニクス実装学会 第32回マイクロエレクトロニクスシンポジウム(MES2022)ベストペーパー賞 Cuを微量添加したAg薄膜を用いた大気中の原子拡散接合法における接合性能
  • 2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Atomic Diffusion Bonding using AlN films
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Association Membership(s) (4):
米国電気学会磁性分科(IEEE,Magnetics Society) ,  日本金属学会 ,  日本磁気学会 ,  エレクトロニクス実装学会
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