Rchr
J-GLOBAL ID：200901036187762580   Update date: Feb. 20, 2023

Shimatsu Takehito

シマツ タケヒト | Shimatsu Takehito
Affiliation and department：
Tohoku University Frontier Research Institute for Interdisciplinary Sciences Advanced Interdisciplinary Research Division Information and System

About Tohoku University Frontier Research Institute for Interdisciplinary Sciences Advanced Interdisciplinary Research Division Information and System


Job title： Professor
Homepage URL  (1)： http://www.fris.tohoku.ac.jp/~shimatsu/index.html
Research field  (3)： Thin-film surfaces and interfaces ,  Electronic devices and equipment ,  Electric/electronic material engineering
Research keywords  (6)： 超高真空 ,  磁性薄膜 ,  スパッタリングプロセス ,  磁気記録媒体 ,  原子拡散接合法 ,  室温接合技術
Research theme for competitive and other funds  (3)：
  • 2008 - 現在 原子拡散接合法による室温接合技術の開発とデバイス形成への応用
  • 1990 - 現在 Sputter film deposition process and microstructure of the deposited thin metal films
  • 1989 - 現在 High density perpendicular recording media
Papers (307)：
  • Nobuaki Kikuchi, Katsunari Sato, Takehito Shimatsu, Satoshi Okamoto. Microwave-assisted switching in granular media with continuous magnetic overlayers for interaction control. Japanese Journal of Applied Physics. 2023. 62. SB. SB1015-SB1015
  • Satoshi Mizutani, Nobuaki Kikuchi, Masatoshi Hatayama, Takehito Shimatsu, Satoshi Okamoto. Thermal activation on microwave-assisted magnetization switching in Co/Pt nanodot arrays. Japanese Journal of Applied Physics. 2023. 62. SB. SB1012-SB1012
  • A. Muraoka, H. Makita, T. Saitoh, M. Uomoto, T. Shimatsu. ATOMIC DIFFUSION BONDING USING ALN FILMS WITH HIGH ELECTRICAL RESISTIVITY. Proceedings of WaferBond’22 Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. 2022. 23-24
  • T. Shimatsu, M. Uomoto, T. Saito, T. Moriwaki, N. Kato. ATOMIC DIFFUSION BONDING OF WAFERS USING VARIOUS OXIDE FILMS. Proceedings of WaferBond’22 Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. 2022. 19-22
  • Shiro Satoh, Koichi Ohtaka, Takehito Shimatsu, Shuji Tanaka. Crystal structure deformation and phase transition of AlScN thin films in whole Sc concentration range. Journal of Applied Physics. 2022. 132. 2. 025103-025103
ｍore...
MISC (76)：
  • Takehito SHIMATSU, Miyuki UOMOTO. Atomic Diffusion Bonding : Room Temperature Bonding of Glass Substrates Using Metal, Oxide and Nitride Thin Films. Vacuum and Surface Science. 2022. 65. 10. 454-459
  • Effect of thermal fluctuations on microwave assisted switching in Co/Pt nanodot array. 2021. 45. 14. 7-11
  • 島津 武仁. 原子拡散接合法:真空中の金属膜表面における原子再配列現象を利用した室温接合技術. 真空ジャーナル. 2021. 175. 12-16
  • マイクロ波アシスト磁化反転. Magnetics Japan. 2020. 15. 2. 89-95
  • Effects of inter-grain exchange coupling on microwave assisted magnetization switching on CoCrPt granular thin films. 2019. 2019. 197. 13-17
ｍore...
Books (2)：
  • 異種材料一体化のための最新技術 ~溶接・接着剤・一体形成・加飾~
    サイエンス&テクノロジー株式会社 2012 ISBN:9784864280365
  • advanced Technologies of Perpendicular Magnetic Recording
    シーエムシー出版 2007
Lectures and oral presentations  (330)：
  • Atomic Diffusion Bonding using AlN Films with High Electrical Resistivity
    (WaferBond'22 Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration 2022)
  • Atomic Diffusion Bonding of Wafers using Various Oxide Films
    (WaferBond'22 Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration 2022)
  • 磁性膜厚のマイクロ波アシスト磁化反転挙動への影響
    (第46回日本磁気学会学術講演会 2022)
  • マイクロ波アシスト磁化反転における熱活性の影響
    (第46回日本磁気学会学術講演会 2022)
  • Cuを微量添加したAg薄膜を用いた大気中の原子拡散接合法における接合性能
    (第32回マイクロエレクトロニクスシンポジウム MES2022 2022)
ｍore...
Education (2)：
  • - 1988 Tohoku University Graduate School, Division of Engineering 電子工学
  • - 1986 Tohoku University Faculty of Engineering 電子工学
Professional career (1)：
  • Ph.D. (Tohoku University)
Awards (17)：
  • 2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Atomic Diffusion Bonding using AlN films
  • 2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Surface Contamination Effects on Bonding Performance in Atomic Diffusion Bonding of Wafers using Amorphous Si Thin Films
  • 2019/05 - 191st Committee on Innovative Interface Bonding Technology Japan Society for the Promotion of Science (JSPS) Best Poster Presentation Award, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding
  • 2018/10 - Electrochemical Society (ECS) AiMES 2018 ECS and SMEQ Joint International Meeting Best Paper Award Atomic Diffusion Bonding for Optical Devices with High Optical Density
  • 2018/01/10 - University of New York, Japan Society for thePpromotion of Science Magnetics and Optics Research International Symposium(MORIS 2018) Best Poster Award Frequency dependence of microwave-assisted switching in CoCrPt granular perpendicular media
Show all
Association Membership(s) (4)：
米国電気学会磁性分科(IEEE,Magnetics Society) ,  日本金属学会 ,  日本磁気学会 ,  エレクトロニクス実装学会
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