Rchr
J-GLOBAL ID:200901036187762580   Update date: Jan. 30, 2024

Shimatsu Takehito

シマツ タケヒト | Shimatsu Takehito
Affiliation and department:
Job title: Professor
Homepage URL  (1): http://www.fris.tohoku.ac.jp/~shimatsu/index.html
Research field  (3): Thin-film surfaces and interfaces ,  Electronic devices and equipment ,  Electric/electronic material engineering
Research keywords  (6): 超高真空 ,  磁性薄膜 ,  スパッタリングプロセス ,  磁気記録媒体 ,  原子拡散接合法 ,  室温接合技術
Research theme for competitive and other funds  (18):
  • 2008 - 現在 原子拡散接合法による室温接合技術の開発とデバイス形成への応用
  • 1990 - 現在 Sputter film deposition process and microstructure of the deposited thin metal films
  • 1989 - 現在 High density perpendicular recording media
  • 2021 - 2024 Research of synthetic antiferromagnet for THz devices with Brillouin light scattering
  • 2020 - 2023 高光透過率で屈折率調整が可能な接合界面を有する完全無機の室温接合技術の開発
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Papers (314):
  • Yuki Watabe, Miyuki Uomoto, Takehito Shimatsu. Atomic Diffusion Bonding of Wafers in Air Using Ag-3at%Cu Films. Journal of The Japan Institute of Electronics Packaging. 2024. 27. 1. 143-149
  • Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, Eiji Higurashi. Suppression of Surface Roughening of Ag Films by Capping Layer for Ag/Ag Surface Activated Bonding. 2023 IEEE CPMT Symposium Japan (ICSJ). 2023
  • Hikaru Iemura, Fuki Goto, Miyuki Uomoto, Takehito Shimatsu. Blade Test in Atmospheric-Pressure Ar Gas to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding. ECS Transactions. 2023. 112. 3. 199-206
  • Fuki Goto, Hikaru Iemura, Miyuki Uomoto, Takehito Shimatsu. Crystal Lattice Rearrangement Occurred at Au/Ag Bonded Interface in Atomic Diffusion Bonding in Vacuum. ECS Transactions. 2023. 112. 3. 191-198
  • Miyuki Uomoto, Shun Kikuchi, Fuki Goto, Takehito Shimatsu. Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study Using Ni and Cu Films. ECS Transactions. 2023. 112. 3. 147-158
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MISC (77):
  • 島津武仁, 魚本 幸. 原子拡散接合法:光デバイス応用に向けた室温・低温接合技術. 月刊オプトロニクス2023年11月号. 2023. 104-107
  • Takehito SHIMATSU, Miyuki UOMOTO. Atomic Diffusion Bonding : Room Temperature Bonding of Glass Substrates Using Metal, Oxide and Nitride Thin Films. Vacuum and Surface Science. 2022. 65. 10. 454-459
  • Effect of thermal fluctuations on microwave assisted switching in Co/Pt nanodot array. 2021. 45. 14. 7-11
  • 島津 武仁. 原子拡散接合法:真空中の金属膜表面における原子再配列現象を利用した室温接合技術. 真空ジャーナル. 2021. 175. 12-16
  • マイクロ波アシスト磁化反転. Magnetics Japan. 2020. 15. 2. 89-95
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Books (2):
  • 異種材料一体化のための最新技術 ~溶接・接着剤・一体形成・加飾~
    サイエンス&テクノロジー株式会社 2012 ISBN:9784864280365
  • advanced Technologies of Perpendicular Magnetic Recording
    シーエムシー出版 2007
Lectures and oral presentations  (341):
  • Suppression of surface roughening of Ag films by capping layer for Ag/Ag surface activated bonding
    (12th IEEE CPMT Symposium Japan (ICSJ2023) 2023)
  • Blade Test in Atmospheric-Pressure Ar Gas to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding
    (244th ECS Meeting 2023)
  • Crystal Lattice Rearrangement Occurred at Au/Ag Bonded Interface in Atomic Diffusion Bonding in Vacuum
    (244th ECS Meeting 2023)
  • Atomic Diffusion Bonding in Air using Oxide Films
    (244th ECS Meeting 2023)
  • Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study using Ni and Cu Films
    (244th ECS Meeting 2023)
more...
Education (2):
  • - 1988 Tohoku University Graduate School, Division of Engineering 電子工学
  • - 1986 Tohoku University Faculty of Engineering 電子工学
Professional career (1):
  • Ph.D. (Tohoku University)
Awards (20):
  • 2023/10 - The Electrochemiacl Society 244th ECS Meeting Best Student Paper Award Blade Test in Atmospheric-Pressure Ar Gas to Characterize Bonded Interface Fabricated Using Atomic Diffusion Bonding
  • 2023/10 - The Electrochemiacl Society 244th ECS Meeting Best Paper Award Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study using Ni and Cu Films
  • 2023/09 - 一般社団法人 エレクトロニクス実装学会 第32回マイクロエレクトロニクスシンポジウム(MES2022)ベストペーパー賞 Cuを微量添加したAg薄膜を用いた大気中の原子拡散接合法における接合性能
  • 2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Atomic Diffusion Bonding using AlN films
  • 2021/10 - IMSI (Institute for Advanced Micro-System Integration) Best Presentation Award in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2021) Surface Contamination Effects on Bonding Performance in Atomic Diffusion Bonding of Wafers using Amorphous Si Thin Films
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Association Membership(s) (4):
米国電気学会磁性分科(IEEE,Magnetics Society) ,  日本金属学会 ,  日本磁気学会 ,  エレクトロニクス実装学会
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