Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips
(IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2008) 2008)
Micro-cone-shaped Au-bump by gas deposition method for 3D-LSI stacking technology
(International 3D System Integration Conference 2008 (3D-SIC 2008) 2008)
Extremely-Small and Blind Volume Control System toward the Atto-liter Liquid Operation
(Second International Symposium on Standard Material And Metrology for Nanotechnology 2006)
3D Lithography with Confocal Laser Scanning Microscope
(Second International Symposium on Standard Material And Metrology for Nanotechnology 2006)