Ueno Kazuyoshi

ウエノカズヨシ | Ueno Kazuyoshi

Affiliation and department：

Research field (1)： Electric/electronic material engineering

Research keywords (2)：電子デバイス電子材料導電体電子物性 , electron devices electronic materials conductor solid state physics

Research theme for competitive and other funds (12)：

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Papers (94)：

Yumehito Temmyo, Reno Hasumi, Kazuyoshi Ueno. Graphene cap formation on nickel thin films by thermal CVD at low temperarure. IEEE International Interconnect Technology Conference 2023. 2023. 8-4. 1-3
Shun Nakajima, Yoko Wasai, Kenji Kawahara, Nataliya Nabatova-Gabain, Ploybussara Gomasang, Hiroki Ago, Hiroyuki Akinaga, Kazuyoshi Ueno. Structural analysis of graphene-capped copper by spectroscopic ellipsometry for humidity reliability assessment. Japanese Journal of Applied Physics. 2023. 62. SC. SC1092-SC1092
Keigo Hosokawa, Kenta Matsunaga, Kazuyoshi Ueno. Intercalated multilayer graphene/Nick graphene/Nickel hybrid antenna with enhanced inductance density for. 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conf. 2023. 2023. 748-750
Ryutaro Tsuchida, Kazuyoshi Ueno. Optimization for current-enhanced solid-state deposition of multilayer graphene with high crystallinity and uniformity. Proceeding of 11th International Conference on Nano and Materials Sciences (ICNMS2023). 2023. 53-58
Kazuyoshi Ueno. Advances in multilayer graphene processes for metallization and high-frequency devices. Japanese Journal of Applied Physics. 2022. 62. SA. SA0802-SA0802

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MISC (149)：

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Patents (27)：

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Books (27)：

半導体・MEMSのための超臨界流体
コロナ社 2012 ISBN:9784339008371
Grain Growth of Electroplated Copper Film by Alternative Annealing Methods(共著)
Conference Proceedings AMC XXIV 2009
Grain Growth of Electroplated Copper Film by Alternative Annealing Methods
Conference Proceedings AMC XXIV 2009
集積回路配線技術の動向と展望(基調講演)
日本機械学会関東支部第13期総合講演会講演論文集 2007
A high reliability Cu dual-damascene interconnection direct- contact via structure(Invited)(共著)
Stress-Induced Phenomena in Metallization, AIP Conf. Proceedings 2001

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Lectures and oral presentations (153)：

Evolution of BEOL Technology withScaling
(2023 International Conference on Electronics Packaging 2023)
窒素プラズマ処理をした銅表面の耐湿性
(電気化学会第90回大会 2023)
ニッケル薄膜抵抗の膜厚依存性と熱的安定性
(電気化学会第90回大会 2023)
BEOL技術の変遷と最近の動向
(2023年第70回応用物理学会春季学術講演会 2023)
電流を印加した多層グラフェンの層交換成長
(電気化学会第89回大会 2023)

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Works (6)：

Material and Process Challenges for Interconnects in Nanoelectronics Era (Invited)
2010 -
Chemical Vapor Deposition of Nanocarbon on Electroless Ni-B Allo Catalyst
2010 -
Material and Process Challenges for Interconnects in Nanoelectronics Era (Invited)
2010 -
Chemical Vapor Deposition of Nanocarbon on Electroless Ni-B Allo Catalyst
2010 -
Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2
2009 -

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Education (2)：

1982 - 1984 Tohoku University Graduate School of Engineering Department of Applied Physics
1978 - 1982 Tohoku University Faculty of Engineering Department of Applied Physics

Professional career (1)：

Work history (5)：

2006/04 - 現在 Shibaura Institute of Technology Department of Electronic Engineering, College of Engineering Professor
2005 - 2006 NEC Electronics Chief Engineer
1996 - 2005 NEC / NEC Electronics Manager
1990 - 1996 NEC Corporation Microelectronics Research Laboratories Supervisor
1984 - 1990 NEC Corporation

Committee career (7)：

2021/04 - 2023/03 電気化学会電子材料委員会委員長
2020/09 - 2021/08 IEEE International Interconnect Technology Conference 2021 (IITC2021) General Chair
2013/04 - 2014/04 Japan Electronics and Information Industries Association (JEITA) Semiconductor Technology Roadmap Committee, WG4 Leader
2010/10 - 2011/10 Advanced Metallization Conference, Asian Session 2011 (ADMETA Plus 2011) General Chair
2008 - 2010 電気学会電子デバイス技術委員会委員長

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Awards (2)：

Association Membership(s) (5)：

Institute of Electrical and Electronics Engineers , 電気学会 , 応用物理学会 , 電子情報通信学会 , 電気化学会

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