Rchr
J-GLOBAL ID：200901067751321479   Update date: May. 01, 2024

Suwabe Hitoshi

スワベ ヒトシ | Suwabe Hitoshi
Affiliation and department：
Kanazawa Institute of Technology Kanazawa Institute of Technology College of Engineering Department of Mechanical Engineering

About Kanazawa Institute of Technology Kanazawa Institute of Technology College of Engineering Department of Mechanical Engineering


Homepage URL  (1)： http://www2.kanazawa-it.ac.jp/mvlab/
Research field  (1)： Manufacturing and production engineering
Research keywords  (4)： laser machining ,  slicing ,  lapping ,  grinding
Research theme for competitive and other funds  (10)：
  • 2020 - 2023 人体に安心安全な医療用工具を製造するためのレーザーによる砥粒固着技術の開発
  • 2014 - 2017 Study on mirror surface slicing of electronic element materials by multi-wire saw
  • 2011 - 2013 Development of high speed plating of diamond wire tool for solar battery wafers and slicing characteristics of diamond wire tool
  • 2004 - 2005 Development of High Speed Dicing of Hard and Brittle Materials Using Ultrasonic Vibration
  • 2001 - 2003 High Speed Slicing by Thin Diamond Wire Tool
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Papers (110)：
  • Hitoshi SUWABE, Takuya KAMIMURA, Ken-ichi ISHIKAWA. Study of factors affecting wafer actions during double-side lapping. Journal of the Japan Society for Abrasive Technology. 2022. 66. 9. 524-529
  • Hitoshi SUWABE, Shohei MIWA, Yoshinori FUNADA, Ken-ichi ISHIKAWA. Development of diamond drilling tool using laser melting method. Journal of the Japan Society for Abrasive Technology. 2022. 66. 5. 263-268
  • SUWABE Hitoshi, ISHIKAWA Ken-ichi, ITOH Daiki. Study on fixed diamond grains on resin coated wire and slicing characteristics. Journal of the Japan Society for Abrasive Technology. 2020. 64. 9. 477-482
  • SUWABE Hitoshi, TAKAHASHI Mayuko, KIMURA Yuki, TOCHIO Takumi, KITAGAWA Yssushi. Application of sugar-based-polyol to working fluid in wire saw. Journal of the Japan Society for Abrasive Technology. 2020. 64. 9. 471-476
  • SUWABE Hitoshi, ISHIKAWA Ken-ichi, KONISHI Yuki, Yoshinori FUNADA. Development of medicak diamond bar fixed diamond grain using laser. 2019. 61-62
ｍore...
MISC (170)：
  • Kazama OOGAMI, Hitoshi SUWABE, Ken-ichi ISHIKAWA. Relationship between groove type of lapping plate and wafer actions. 2023. 404-405
  • Yuma INA, Hitoshi SUWABE, Ken-ichi ISHIKAWA. Effect of working liquid on surface of properties of soda glass by diamond wire saw. 2023. 404-405
  • Kosuke Takayama, Hitoshi SUWABE, Yoshinori FUNADA, Ken-ichi ISHIKAWA. Study on processing characteristics of diamond milling tools fixed abrasive grains by laser. 2023. 312-313
  • Kosei Iwasa, Hitoshi Suwabe, Kenichi Ishikawa. Effect of base liquid of slurry and wire on processing characteristics of multi-wire saw. 2023. 298-299
  • Kotaro TANAKA, Hitoshi SUWABE, Ken-ichi ISIKAWA. Effect of slurry on multi-wire saw using resin coated wire. 2023. 296-297
ｍore...
Books (2)：
  • 先端半導体製造プロセスの最新動向と微細化技術
    技術情報協会 2023 ISBN:9784861049828
  • 改訂版 切削・研削・研磨用語辞典
    日本工業出版 2016 ISBN:9784819028134
Education (2)：
  • - 1989 Kanazawa Institute of Technology Graduate School, Division of Engineering
  • - 1984 Kanazawa Institute of Technology Faculty of Engineering
Professional career (1)：
  • 工学博士
Work history (6)：
  • 2006/04 - Kanazawa Institute of Technology
  • 1998 - 1999 Georgia Institute of Technology, Visiting Professor
  • 1992 - 1996 Kanazawa Institute of Technology, Assistant Professor
  • 1996 - Kanazawa Institute of Technology, Asssociate Professor
  • 1990 - 1992 Kanazawa Institute of Technology, Research Assistant Scientist
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Association Membership(s) (4)：
砥粒加工学会 ,  日本設計工学会 ,  精密工学会 ,  日本機械学会
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