Ohguchi Ken'ichi

オオグチケンイチ | Ohguchi Ken'ichi

Affiliation and department：
Job title： Professor

Research field (1)： Machine materials and mechanics

Research keywords (8)：クリープ変形 , 塑性変形 , 計算力学 , 材料力学 , Fatigue , Constitutive Model , Creep , Plasticity

Research theme for competitive and other funds (15)：

2018 - 2021 Development of Microsoldering Method Based on High Accuracy FEA Regarding Primary Tin Crystal and Intermetallic Compounds as Structural Members
2014 - 2017 Development of HALT Method for Assuring Strength Reliability of Micro Solder Joint Based on Analysis of Creep and Ratchetting Behavior
2010 - 2012 Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior
2007 - 2008 ELASTO-PLASTIC-CREEP CHARACTERISTICS OF ELECTROPLATED COPPER FOIL AND ITS ESTIMATION BY STEPPED MICRO INDENTATION
2007 - 電解めっき銅箔の粘塑性変形に関する研究

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Papers (78)：

Ken-ichi Ohguchi, Katsuhiko Sasaki, Kohei Fukuchi, Yorimasa Tsubota, Takuro Mita, Wataru Nagai, Kouji Ohsato, Nobuaki Shinya. A material constants estimation method for efficient elastic-plastic-creep simulation of aluminum alloys by effective utilization of stored test data. Mechanics of Time-Dependent Materials. 2022
Kohei FUKUCHI, Ken-ichi OHGUCHI, Katsuhiko SASAKI, Yorimasa TSUBOTA, Takuro MITA, Wataru NAGAI, Kouji OHSATO, Nobuaki SHINYA. Evaluation of high-temperature fatigue life of aluminium alloys using plastic-creep separation method. Transactions of the JSME (in Japanese). 2021. 87. 895. 20-00378
Kengo KUROSAWA, Ken-ichi OHGUCHI, Kohei FUKUCHI, Atsuko TAKITA. Evaluation of material nonlinearity of Cu/Sn IMCs based on FEA of shear test using copper-solder joints. QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 2020. 38. 4. 429-437
Takashi SEKINE, Akihiro NINO, Yasushi SUGAWARA, Shigeaki SUGIYAMA, Ken-ichi OHGUCHI, Hitoshi TAIMATSU. Synthesis and Mechanical Properties of AlN-WC Ceramics. Journal of the Japan Society of Powder and Powder Metallurgy. 2020. 67. 10. 581-587
Ken-ichi Ohguchi, Katsuhiko Sasaki, Yuki Yuze, Kohei Fukuchi. Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading. Mechanical Engineering Journal. 2019. 6. 5

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MISC (45)：

OHGUCHI Ken-ichi, KUROSAWA Kengo. OS1303-290 Tensile Characteristics of Cu/Sn IMCs Estimated by Using Miniature Composite Solder Specimen. 2015. 2015. "OS1303-290-1"-"OS1303-290-3"
TAKITA Atsuko, SASAKI Katsuhiko, OHGUCHI Ken-ichi, FUJIKI Hiroyuki. OS1319-148 Evaluation of Creep Deformation by Indentation Test with a Constant Depth : Applicability for Inhomogeneous Materials. 2015. 2015. "OS1319-148-1"-"OS1319-148-3"
TAKITA Atsuko, SASAKI Ktsuhiko, OHGUCHI Ken-ichi. J0410205 Creep Deformation Estimation of the Lead-free Solder by Indentation Test with Constant Depth Process. Mechanical Engineering Congress, Japan. 2015. 2015. "J0410205-1"-"J0410205-5"
OHGUCHI Ken-ichi, KUROSAWA Kengo, ISHIZAWA Yuya. J0410303 Material Nonlinearity of Cu/Sn IMCs Evaluated by Conducting FEA of Shear Test Using Cu-Solder Joint. Mechanical Engineering Congress, Japan. 2015. 2015. "J0410303-1"-"J0410303-4"
NATORI Takuya, OHGUCHI Ken-ichi. J0410302 Recovery Behavior of Creep Strain Hardening of SAC Solder by Stress Variation. Mechanical Engineering Congress, Japan. 2015. 2015. "J0410302-1"-"J0410302-4"

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Education (4)：

Professional career (1)：

Awards (1)：

Association Membership(s) (4)：

日本溶接学会 , 日本鋳造工学会 , 日本金属学会 , 日本機械学会

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