Rchr
J-GLOBAL ID:200901081098078140   Update date: Oct. 09, 2024

Koike Junichi

コイケ ジュンイチ | Koike Junichi
Affiliation and department:
Job title: Professor
Homepage URL  (2): http://db.tohoku.ac.jp/whois/detail/b55668c15e4b730c54e60570bafd400d.htmlhttp://db.tohoku.ac.jp/whois/e_detail/b55668c15e4b730c54e60570bafd400d.html
Research field  (2): Structural and functional materials ,  Metallic materials
Research keywords  (4): magnesium alloys ,  thin film electrode ,  FPC ,  interconnect
Research theme for competitive and other funds  (30):
  • 2005 - 現在 Improvement of contact resistivity and mechanical reliability for metal/SiC interface for power device application
  • 2003 - 現在 Development of hybrid transparent electrode materials for flexible devices
  • 2002 - 現在 Evaluation and improvement of interface adhesion strength of flexible printed circuit materials
  • 2000 - 現在 Development of highly reliable interconnect material for advanced semiconductor devices
  • 2000 - 現在 Evaluation of interface adhesion strength in nanometer scale
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Papers (285):
  • Nobuaki Takeuchi, Daisuke Ando, Koike Junichi, Yuji Sutou. Low-Temperature Oxidation-Sintering Behaviors of Cu Fine Particles. Materials Transactions. 2023. 64. 4. 931-938
  • Takeuchi Nobuaki, Ando Daisuke, Koike Junichi, Sutou Yuji. Low Temperature Oxidation-Sintering Behaviors of Cu Fine Particles. Journal of the Japan Institute of Metals and Materials. 2022. 86. 11. 224-231
  • Linghan Chen, Qian Chen, Daisuke Ando, Yuji Sutou, Momoji Kubo, Junichi Koike. Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges. Applied Surface Science. 2021. 537
  • Linghan Chen, Sushant Kumar, Masataka Yahagi, Daisuke Ando, Yuji Sutou, Daniel Gall, Ravishankar Sundararaman, Junichi Koike. Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials. Journal of Applied Physics. 2021. 129. 3
  • Linghan Chen, Daisuke Ando, Yuji Sutou, Masataka Yahagi, Junichi Koike. Possibility of Cu2Mg for Liner-Barrier Free Interconnects. 2020 IEEE International Interconnect Technology Conference (IITC). 2020
more...
MISC (149):
  • 竹内喬亮, 安藤大輔, 小池淳一, 須藤祐司, 須藤祐司. Cu微粒子の酸化焼結メカニズム. 日本金属学会講演大会(Web). 2023. 172nd
  • Effect of an oxide layer at Co/Si interface on Schottky barrier height and contact resistivity. 2019. 119. 239. 35-38
  • 内山愛文, 安藤大輔, 須藤祐司, 小池淳一. 異なるLPSO相量を有するMg-Zn-Gd系合金圧延材の機械特性と組織の関係. 日本金属学会講演概要(CD-ROM). 2019. 164th
  • 山岸奎佑, 安藤大輔, 須藤祐司, 小池淳一. Mg-Sc二元系合金の室温超弾性における粒径依存性. 日本金属学会講演概要(CD-ROM). 2019. 164th
  • 須藤祐司, 関谷暢, 安藤大輔, 小池淳一. Ti-Mo-Cコーティングの硬さおよび摩擦摩耗特性に及ぼす成膜圧力の影響. 日本金属学会講演概要(CD-ROM). 2019. 164th
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Lectures and oral presentations  (38):
  • Possibility of Cu-Mn alloy for TFT gate electrode
    (International Display Workshop 2007 2007)
  • Deformaton and fracture mechanisms of Mg alloys
    (Asian Forum on Light Metals and Exhibition 2007)
  • Possibility and problems of self-forming barrier process for advanced LSI metallization
    (Advanced Metallization Conference 2007)
  • Role of twinning on deformation mechanisms of Mg alloys
    (2nd Asian Syposium on Magnesium Alloys 2007)
  • Role of twinning on deformation mechanisms of Mg alloys
    (Workshop on advanced magnesium alloys and their applications 2007)
more...
Education (3):
  • - 1989 Northwestern Graduate School, Division of Engineering Materials Science and Engineering
  • - 1985 Tokyo Institute of Technology 理工学研究科 金属工学専攻
  • - 1983 Tokyo Institute of Technology Faculty of Engineering 金属工学科
Professional career (3):
  • Ph. D. (Northwestern University)
  • Master of Engineering (Tokyo Institute of Technology)
  • Bachelor of Engineering (Tokyo Institute of Technology)
Committee career (4):
  • 2000/03 - 現在 日本金属学会 分科会 幹事
  • 2000/03 - 現在 日本金属学会 分科会 幹事
  • 2006/03 - 2010/03 日本金属学会 評議員
  • 2006/03 - 2010/03 日本金属学会 評議員
Awards (18):
  • 2021/03 - 日本金属学会 谷川・ハリス賞
  • 2018/05 - 公益財団法人本多記念会 第15回本多フロンティア賞
  • 2018/03 - 日本金属学会 第24回 日本金属学会増本量賞
  • 2013/04 - 平成25年度科学技術分野 文部科学大臣表彰 科学技術賞
  • 2008/07/17 - Materials Research Society Outstanding Symposium Paper MRSシンポジウムにおける優秀論文
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Association Membership(s) (4):
日本鉄鋼協会 ,  アメリカ材料学会(Materials Research Society) ,  応用物理学会 ,  日本金属学会
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