Rchr

J-GLOBAL ID：200901086998110777 Update date: Sep. 27, 2024

Miura Hideo

ミウラヒデオ | Miura Hideo

Affiliation and department：
Job title： Professor
Other affiliations (1)：

Tohoku University Representative Chair of Division of Mechanical Engineering

Homepage URL (2)： http://db.tohoku.ac.jp/whois/detail/cf4ce965da1a25a6e4afc6406a2c5139.html , http://db.tohoku.ac.jp/whois/e_detail/cf4ce965da1a25a6e4afc6406a2c5139.html

Research field (3)： Electronic devices and equipment , Machine materials and mechanics , Semiconductors, optical and atomic physics

Research keywords (3)： Explication of physical properties of nanostructures , Optimum design of electronic functions and reliability , Nano and micro structures

Research theme for competitive and other funds (18)：

2021 - 2024 Quantitative Evaluation of residual life of heat-resistant alloy under random creep-fatigue loadings at elevated temperature
2021 - 2023 Explication of the degradation mechanism of the strength of heat-resistant alloys under random loading at elevated temperatures and the establishment of the prediction method of their lifetime
2021 - 2023 高温変動負荷環境における耐熱合金強度劣化損傷機構の解明と残存寿命予測技術の確立
2021 - 2023 Construction of Production Base of Strain-Controlled Graphene Nanoribbon-Base Bio-Sensor for Detecting Multi-Molecules in Liquid
2020 - 2023 Strain-Controlled Graphene-Nanoribbon-Base Biochemical Sensors with High Selectivity and Sensitivity

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Papers (310)：

Meng Yin, Xiangyu Qiao, Lei Wang, Hideo Miura, Ken Suzuki. Strain-modulated adsorption of gas molecule on graphene: First-principles calculations. Diamond and Related Materials. 2024. 142
Ayumi Nakayama, Run Zi Wang, Ken Suzuki, Hideo Miura. Stress-Induced Acceleration of the Growth of δ-Phase Precipitates in Ni-Based Superalloy GH4169 (IN718) and Its Effect on the Acceleration of Intergranular Cracking Under Creep Loading at Elevated Temperature. Minerals, Metals and Materials Series. 2024. 369-378
Le Xu, Lv Yi Cheng, Kai Shang Li, Ken Suzuki, Hideo Miura, Run Zi Wang. Creep damage evolution by cavity nucleation and growth considering the cavity closure under cyclic loading conditions. Fatigue and Fracture of Engineering Materials and Structures. 2024
Lei Wang, Ya Ning Sun, Xian Deng Wei, Meng Yin, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang. The uniaxial zero thermal expansion and zero linear compressibility in distorted Prussian blue analogue RbCuCo(CN)6. Physical Chemistry Chemical Physics. 2023. 25. 48. 32845-32852
Lv Yi Cheng, Run Zi Wang, Kai Shang Li, Hai Long Guo, Le Xu, Ken Suzuki, Hideo Miura, Xian Cheng Zhang, Shan Tung Tu. Geometric discontinuity effect on creep-fatigue behaviors in a nickel-based superalloy hole structure considering ratcheting deformation. International Journal of Fatigue. 2023. 175

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MISC (217)：

TAKAHASHI Motoki, SUZUKI Ken, MIURA Hideo. 120 Investigation of the Dominant Factor of Degradation of Ni-based Super Alloy Considering the Change of Atomic Configuration. 2016. 2016. 51. 37-38
Murakoshi Takuya, Suzuki Ken, Miura Hideo. 119 Damage Mechanism of Heat-Resistant Material Caused by the Change of Its Micro Texture Under Mechanical Loading at High Temperature. 2016. 2016. 51. 35-36
NAKANISHI Takahiro, ICHIKAWA Yuji, SUZUKI Ken, MIURA Hideo. 144 Development of the Measurement method of the Strength of a Grain Boundary. 2016. 2016. 51. 85-86
KATO Takeru, SUZUKI Ken, MIURA Hideo. 136 Clarification and Control of the Multiple factors for the Long-term Reliability of the Sub-micro-size Copper Thin-film Interconnections. 2016. 2016. 51. 69-70
LIU Jiatong, SUZUKI Ken, MIURA Hideo. 138 Effect of the Crystallinity of Underlayer Material on Microtexture of electroplated Copper thin Film. 2016. 2016. 51. 73-74

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Patents (176)：

半導体装置
半導体装置の製造方法
半導体装置
半導体装置
半導体装置の製造方法

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Books (7)：

破壊力学大系
(株)エヌティーエス 2012
機械実用便覧
日本機械学会 2011
製品開発のための材料力学と疲労設計入門
日刊工業新聞社 2009 ISBN:9784526062155
図解最先端半導体パッケージ技術のすべて
(株)工業調査会 2007
「学びの転換」を楽しむ
東北大学出版会 2007

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Lectures and oral presentations (91)：

Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections
(2019)
Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections
(IEEE 20th International Conference on Electronic Materials And Packaging 2018)
Quantitative Characterization of the Crystallinity of Polycrystalline Materials by Applying Electron Back-Scatter Diffraction
(22nd International Conference on Advanced Materials and Nanotechnology 2018)
Disappearance of Martensitic Strengthened-Micro-Texture in Modified 9Cr-1Mo Steel Caused by Stress-induced Acceleration of Atomic Diffusion at Elevated Temperatures
(17th International Conference on Fracture and Damage Mechanics 2018)
Crystallinityinduced Variation of the Strength of a Grain and a Grain Boundary
(European Advanced Materials Congress (EAMC2018) 2018)

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Education (3)：

1989 - 1990 Massachusetts Institute of Technology Materials Science and Engineering
1981 - 1983 Tohoku University Graduate School of Engineering Department of Electronic Engineering
1977 - 1981 Tohoku University Faculty of Engineering Electrical Engineering

Professional career (1)：

PhD (Tohoku University)

Work history (4)：

2015/04 - 現在 Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University Professor
2004/04 - 2015/03 Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University Professor
2003/02 - 2004/03 Fracture Research Institute, Graduate School of Engineering, Tohoku University Professor
1983/04 - 2003/01 Mechanical Engineering Research Lab., Hitachi, Ltd. Section Maneger, Chief Researcher

Committee career (82)：

2011/04 - 現在日本機械学会英文論文誌編集委員
2011/04 - 現在日本機械学会英文論文誌編集委員
2008/01 - 現在 IEEE Division of Power Electronics and Packaging 論文校閲委員
2008/01 - 現在 IEEE Division of Power Electronics and Packaging 論文校閲委員
2007/01 - 現在日本材料学会マイクロマテリアル部門委員会委員

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Awards (38)：

2018/10 - IEEE Best Student Paper Award of Electronic Material Division Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test
2018/10 - IEEE Best Student Award of Sensor Division Proposal of Highly sensitive pressure sensor using Graphene Nano-Ribbon
2017/09/28 - IEEE Contribution Award for 15-Series Organization of IEEE Electronics Materials and Packaging Conferences 15-series organization of IEEE EMAP Conferences
2017/04/19 - 文部科学省科学技術分野の文部科学大臣表彰科学技術賞(研究部門) 原子配列の秩序性変化に基づく材料劣化損傷に関する研究
2016/10/14 - Int. Conf. on Nanomedicine and Nanotechnology Outstanding Presentation Award Graphene Nano-Ribbon-base Highly Sensitive Strain Sensor

2016/09/12 - 6th Int. Conf on Materials Science and Engineering Contribution Award Contribution to the Materials Science and Engineering

2015/11/19 - ASME Electronic and Photonic Packaging Division Best Runner-Up Poster Award Micro Tensile Test for Measuring the Strength of Grain Boundaries

2014/07/20 - 日本機械学会材料力学部門日本機械学会材料力学部門業績賞半導体デバイス構造・材料の強度信頼性評価に関する先駆的研究

2014/06/03 - 日本溶射学会 Best Paper Award EBSDを用いたコールドスプレー皮膜の微細組織評価

2013/10/08 - IEEE CPMT Division Outstanding Poster Paper Award Strain-induced Change of Electronic Conductivity of Graphene Sheets and Nano-Ribbon

2013/07/18 - ASME Contribution Award of ASME InterPack2013 Chief Track Organizer

2013/04/10 - IEEE and JIEP Best Paper Award of ICEP 2012 Effect of the crystallinity of electroplated copper thin films on their mechanical and electrical reliability

2012/03/11 - エレクトロニクス実装学会 Outstanding Paper Award of Japan Institute of Electronic Packaging 半導体レーザ発光スペクトルのひずみ依存性

2011/07/01 - ASME Best Paper Award of ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging andIntegration of Electronic and Photonic Systems, MEMS and NEMS MINIMIZATION OF THE LOCAL RESIDUAL STRESS IN 3D FLIP CHIP STRUCTURES

2011/06/01 - IEEE CPMT Division Outstanding Poster Paper Award of IEEE 60th ECTC Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures

2010/08/10 - IEEE CPMT Division Best Session Paper Award Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures

2010/05/28 - エレクトロニクス実装学会 Best Paper Award of the Japan Institute of Electronic Packaging ピエゾ抵抗ひずみセンサを用いたフリップチップ実装構造内局所2軸残留応力分布の測定

2010/05/12 - IEEE CPMT Division and JIEP Outstanding Paper Award of ICEP 2009 Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both Mechanical and Electrical Properties of the Jointed Structures

2009/07/22 - ASME EEPD Division Contribution Award for ASME InterPACK'09

2009/07/22 - ASME Best Poster Award In-situ monitoring method of the chnage of the residual stress in a transistor structure during it sfabrication process

2009/03/25 - 日本機械学会日本機械学会フェロー

2008/05/30 - IEEE CPMT Society Contribution Award for IEEE 58th ECTC

2008/04/08 - 日本機械学会日本機械学会賞(論文賞) ディープサブミクロンMOSFETの応力起因ドレイン電流変動評価手法の開発

2008/04/08 - 社団法人日本機械学会 Best Paper Award from JSME

2007/07/11 - ASME Electronic and Photonic Packaging Divison Contribution Award In recognition of and in testimony to the high regard of your assiciates and the deep appreciation of the society for your valued services in advancing the engineering profession

2007/07/11 - Manufacturing and Test Track of the The ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems Outstanting Paper Award Development of a nondestructive inspection method for detecting open failures of interconnections in three-dimensionally stacked assembly systems

2007/07/11 - Packaging Material and Process Track of The ASME Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems Outstanding Paper Award MICRO TEXTURE-INDUCED VARIATION OF MECHANICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILMS

2006/05/25 - 日本機械学会貢献賞長年にわたる論文査読実績

2001/11/01 - 日本機会学会材料力学部門日本機械学会材料力学部門優秀技術賞

2000/04/06 - 社団法人日本機械学会 Best Paper Award from JSME

1999/10/19 - 日本発明協会関東地方発明表彰発明奨励賞

1994/05/26 - 日本電子顕微鏡学会日本電子顕微鏡学会写真コンクール入賞

1993/09/06 - The Institute of Electrical and Electronics Engineering, Inc. Best Paper Award Simulation of Semiconductor Devices and Processes 1993

1993/04/02 - 社団法人日本機械学会 Best Paper Award from JSME

1992/04/12 - The American Society of Mechanical Engineers Best Conference Paper Award 1992 ASME/JSME Joint Conf. on Electronic Packaging

1991/03/16 - 日本非破壊検査協会 Best Paper Award from NDI Japan

1989/04/06 - 日本機会学会日本機械学会賞研究奨励賞

1987/10/22 - 日本非破壊検査協会日本非破壊検査協会奨励賞

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Association Membership(s) (5)：

Japan Society of Materials Science , Materials Research Society , Japan Institute of Electronics Packaging , The Japan Society of Mechanical Engineering , The Insitute of Electrical and Electronics Engineers, Inc.

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