Art
J-GLOBAL ID：200902000854420560   Reference number：88A0131619

Electroless copper deposition with hypophosphite as reducing agent.

還元剤に亜りん酸塩を用いた無電解銅めっき
Author (1)：
HUNG A

About HUNG A

(Ming-Hsin Engineering Coll., Hsin-Chu, TWN)

About Ming-Hsin Engineering Coll., Hsin-Chu, TWN


Material：
Plating & Surface Finishing  (Plat Surf Finish)

About Plating & Surface Finishing


Volume： 75  Issue： 1  Page： 62-65  Publication year： Jan. 1988 
JST Material Number： D0341A  ISSN： 0360-3164  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
reducing agent

About reducing agent

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Electroless plating 
(WC08024S)

About Electroless plating

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
還元剤

About 還元剤

, 
亜りん酸塩

About 亜りん酸塩

, 
電解

About 電解

, 
銅めっき

About 銅めっき


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