Art
J-GLOBAL ID：200902004983902305   Reference number：92A0019296

Elastic-Creep Behavior and Fatigue Life in an IC Package Solder Joint.

ICパッケージ半田接合部の弾クリープ解析と疲労寿命
Author (4)：
MUKAI MINORU

About MUKAI MINORU

(東芝)

About 東芝

, 
KAWAKAMI TAKASHI

About KAWAKAMI TAKASHI

(東芝)

About 東芝

, 
ENDO TETSUYA

About ENDO TETSUYA

(東芝)

About 東芝

, 
TAKAHASHI KUNIAKI

About TAKAHASHI KUNIAKI

(東芝)

About 東芝


Material：
日本機械学会計算力学講演会講演論文集  (日本機械学会計算力学講演会講演概要集)

About 日本機械学会計算力学講演会講演論文集


Volume： 4th  Page： 223-224  Publication year： Nov. 1991 
JST Material Number： L0203A  ISSN： 1348-026X  Document type： Proceedings
Article type： 短報  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
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All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
integrated circuit

About integrated circuit

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
thermal fatigue

About thermal fatigue


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JST classification (1)：
JST classification
Category name(code) classified by JST.
Solic-state devices in general 
(NC03010Z)

About Solic-state devices in general

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
ICパッケージ

About ICパッケージ

, 
半田接合部

About 半田接合部

, 
クリープ

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, 
解析

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, 
疲労寿命

About 疲労寿命


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